IR3550MTRPBF International Rectifier, IR3550MTRPBF Datasheet - Page 20

• Manufacturer Part Number: IR3550MTRPBF
• Description: The IR3550 integrated PowIRstage is a synchronous buck gate driver IC with co-packed control and synchronous MOSFETs and Schottky diode.
• Manufacturer: International Rectifier

Specifications of IR3550MTRPBF

• Package: PQFN / 6 x 6
• Iout (a): 60
• Switch Freq (khz): up to 1.0MHz
• Input Range (v): 4.5 - 15
• Output Range (v): 0.25 - (VCC -2.5)

STENCIL DESIGN
* Contact International Rectifier to receive an electronic PCB Library file in Cadence Allegro or CAD DXF/DWG format.
 The stencil apertures for the lead lands should be
 The low power signal stencil lead land apertures
approximately 65% to 75% of the area of the lead
lands depending on stencil thickness. Reducing
the amount of solder deposited will minimize the
occurrence of lead shorts. Since for 0.5mm pitch
devices the leads are only 0.25mm wide, the
stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult
to maintain repeatable solder release.
should therefore be shortened in length to keep
area ratio of 65% to 75% while centered on lead
land.
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March 12, 2012 | FINAL DATASHEET
Figure 35: Stencil design
60A Integrated PowIRstage®
 The power pads VIN, PGND, TGND and SW, land
 The maximum length and width of the land pad
pad apertures should be approximately 65% to
75% area of solder on the center pad. If too much
solder is deposited on the center pad the part will
float and the lead lands will be open. Solder
paste on large pads is broken down into small
sections with a minimum gap of 0.2mm between
allowing for out-gassing during solder reflow.
stencil aperture should be equal to the solder
resist opening minus an annular 0.2mm pull back
to decrease the incidence of shorting the center
land to the lead lands when the part is pushed
into the solder paste.
IR3550