LPC1769 NXP Semiconductors, LPC1769 Datasheet - Page 40

• Manufacturer Part Number: LPC1769
• Description: 32-bit Arm Cortex-m3 Microcontroller; Up To 512 Kb Flash And 64 Kb Sram With Ethernet, Usb 2.0 Host/device/otg, Can
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC1769_68_67_66_65_64_4
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
−
=
T
R
P
40
amb
D
T
th(j-a)
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
+
= the package junction-to-ambient thermal resistance (°C/W)
(
P
D
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 04 — 1 February 2010
–
)
)
LPC1769/68/67/66/65/64
j
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2010. All rights reserved.
Unit
°C
40 of 66
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