HM-6551FWDSLASH883 Intersil Corporation, HM-6551FWDSLASH883 Datasheet - Page 9

• Manufacturer Part Number: HM-6551FWDSLASH883
• Description: 256x4 Cmos Ram
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
Metallization Mask Layout
NOTE: Pin numbers correspond to DIP Package only.
132 x 160 x 19 ±1mils
Type: Si - Al
Thickness: 11k
Type: SiO
Thickness: 8k
VCC
A4
A3
A2
A1
W
2
Å
Å
±1k
±2k
Å
Å
9
A0
S1
HM-6551/883
HM-6551/883
HM-6551/883
A5
WORST CASE CURRENT DENSITY:
LEAD TEMPERATURE (10s soldering):
A6
1.337 x 10
≤300
E
o
C
5
A/cm
S2
2
A7
Q3
GND
D3
Q2
D2
Q1
D1
Q0
D0