PMMA7450LR2 Freescale Semiconductor, Inc, PMMA7450LR2 Datasheet - Page 21

• Manufacturer Part Number: PMMA7450LR2
• Description: ?2g/?4g/?8g Three Axis Low-g Digital Output Accelerometer
• Manufacturer: Freescale Semiconductor, Inc

design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
package inertial sensors to printed circuit boards (PCBs). The
purpose is to minimize the stress on the package after board
mounting. Both the MMA73x0L 3 axis analog output family of
accelerometers and the MMA7450L digital output
accelerometer use the Land Grid Array (LGA) package
platform. This section describes suggested methods of
soldering these devices to the PC board for consumer
applications.
lead, 3 x 5 mm individual sensor device.
recommended PCB land pattern for the package.
Sensors
Freescale Semiconductor
SOLDERING AND MOUNTING GUIDELINES FOR THE LGA ACCELEROMETER SENSOR TO A PC BOARD
Surface mount board layout is a critical portion of the total
With the correct footprint, the packages will self-align when
These guideline are for soldering and mounting the LGA
Figure 18. LGA 14-Lead, 5 x 3 mm Die Sensor
Figure 18
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
INTRODUCTION
shows the bottom view of LGA 14
CASE 1881-04
Bottom View
14 LEAD
LGA
Figure 19
shows the
executed on LGA devices. They do not represent exact
conditions present at a customer site. Hence, information
design optimizations are recommended to develop an
application specific solution. It should be noted that with the
proper PCB footprint and solder stencil designs the package
will self-align during the solder reflow process.
14x0.6
OVERVIEW OF SOLDERING CONSIDERATIONS
Figure 19. Recommended PCB Land Pattern for the
Information provided here is based on experiments
herein should be used as a guidance only and process and
10x0.8
14x0.9
1
6
5 x 3 mm LGA Package
MMA7450L
12x1
8
13
6x2
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