PMMA7450LR2 Freescale Semiconductor, Inc, PMMA7450LR2 Datasheet - Page 23

• Manufacturer Part Number: PMMA7450LR2
• Description: ?2g/?4g/?8g Three Axis Low-g Digital Output Accelerometer
• Manufacturer: Freescale Semiconductor, Inc

Sensors
Freescale Semiconductor
10. Do not use a screw down or stacking to fix the PCB into
6. Do not place any components or vias at a distance less
7. Signal traces connected to pads should be as
8. Use a standard pick and place process and equipment.
9. It is recommended to use a cleanable solder paste with
than 2mm from the package land area. This may cause
additional package stress if it is too close to the
package land area.
symmetric as possible. Put dummy traces on NC pads
in order to have same length of exposed trace for all
pads. Signal traces with 0.1mm width and min. 0.5mm
length for all PCB land pads near the package are
recommended as shown in
Figure
0.5mm zone.
Do not us a hand soldering process.
an additional cleaning step after SMT mount.
an enclosure because this could bend the PCB putting
stress on the package.
24. Wider trace can be continued after the
PCB landpad pad
= 0.6x0.9mm
Figure 24. Stencil Design Guidelines (detailed dimensions for corner pads)
0.875mm
0.2875mm
Figure
0.575mm
22,
0.2875mm
Figure
Stencil opening for
normal pads =
0.575x0.875
0.875mm
23, and
0.2875mm
0.625mm
0.3375mm
mounting guidelines specific to the exact device used.
Hazardous Substances (RoHS), having halide free molding
compound (green) and lead-free terminations. These
terminations are compatible with tin-lead (Sn-Pb) as well as
tin-silver-copper (Sn-Ag-Cu) solder paste soldering
processes. Reflow profiles applicable to those processes can
be used successfully for soldering the devices.
LGA die accelerometers. This document suggests soldering
methods for the MMA73x0L family and the MMA7450L
accelerometers.
11. The PCB should be rated for the multiple lead-free
Please cross reference with the device datasheet for
Freescale LGA sensors are compliant with Restrictions on
There are many new applications being designed using
0.050mm offset
reflow condition with max 260°C temperature.
Stencil opening for 4 corner pads
= 0.625x0.875mm sq.
Package
footprint
SUMMARY
MMA7450L
23