MAX1555EZK Maxim, MAX1555EZK Datasheet - Page 3

• Manufacturer Part Number: MAX1555EZK
• Description: PLASTIC ENCAPSULATED DEVICES
• Manufacturer: Maxim

II. Manufacturing Information
III. Packaging Information
IV. Die Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
per JEDEC standard JESD22-A112: Level 1
SOT23 Dual-Input USB/AC Adapter 1-Cell Li+ Battery Charger
B8 - Standard 8 micron silicon gate CMOS
541
California, USA
Philippines
June, 2003
5-Lead SOT23
Copper
Solder Plate
Silver-filled Epoxy
Gold (1.0 mil dia.)
Epoxy with silica filler
Buildsheet # 05-9000-0523
Class UL94-V0
59 X 40 mils
Si
TiW/ AlCu/ TiWN
None
.8 microns (as drawn)
.8 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide)