MT28C128532W18 Micron Technology, MT28C128532W18 Datasheet - Page 20

• Manufacturer Part Number: MT28C128532W18
• Description: (MT28C128532W18 / MT28C128564W18) 128Mb Multibank Burst Flash 32Mb ASYNC/PAGE CellularRAM COMBO Memory
• Manufacturer: Micron Technology

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NOTE:
Data Sheet Designation
Advance:
ming, and timing, please refer to the MT28F644W18/W30 data sheet at
MT45W2MW16PFA and MT45W4MW16PFA data sheets at http://www.micron.com/cellularram.
09005aef80b10a55
MT28C128564W18D_B.fm - Rev. B, Pub 7/03 EN
1. All dimensions in millimeters.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS Ø 0.35mm ON A
0.30mm SMD BALL PAD.
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
For additional documentation concerning Flash and CellularRAM features, functional descriptions, program-
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
SEATING PLANE
77X
This data sheet contains initial descriptions of products still under development.
7.20
Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
0.35
3.60 ±0.05
BALL A8
0.10 C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1.025 ±0.075
C
All other trademarks are the property of their respective owners.
2.80 ±0.05
8.00 ±0.10
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
5.60
0.80
TYP
C L
4.00 ±0.05
Figure 5: 77-Ball FBGA
C L
5.00 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
20
128Mb MULTIBANK BURST FLASH
10.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice..
1.40 MAX
SOLDER BALL MATERIAL:
EUTECTIC 62% Sn, 36% Pb, 2% Ag
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
www.micron.com/flash
BALL A1 ID
©2003 Micron Technology, Inc
ADVANCE
and the