NE33284A-SL NEC, NE33284A-SL Datasheet - Page 8

no-image

NE33284A-SL

Manufacturer Part Number
NE33284A-SL
Description
L to X BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET
Manufacturer
NEC
Datasheet
RECOMMENDED SOLDERING CONDITIONS
different conditions.
<TYPES OF SURFACE MOUNT DEVICE>
1207)
[NE33284A]
8
Infrared ray reflow
Partial heating method
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-
*:
Note: Do not apply more than a single process at once, except for “Partial heating method”.
PRECAUTION: Avoid high static voltage and electric fields, because this device is Hetero Junction field effect
Soldering process
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 ˚C and relative humidity at 65 % or less.
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the Japanese law concerned and so on, especially in case of removal.
transistor with shottky barrier gate.
Peak package’s surface temperature: 230 ˚C or below, Reflow
time: 30 seconds or below (210 ˚C or higher), Number of reflow
process: 1, Exposure limit*: None
Terminal temperature: 230 ˚C or below, Flow time: 10 seconds or
below, Exposure limit*: None
Soldering conditions
Caution
IR30-00
Symbol
NE33284A

Related parts for NE33284A-SL