MTV25N50E Motorola, MTV25N50E Datasheet
MTV25N50E
Available stocks
Related parts for MTV25N50E
MTV25N50E Summary of contents
Page 1
... Thermal Clad is a trademark of the Bergquist Company. Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1996 D N–Channel G Rating ) Order this document by MTV25N50E/D MTV25N50E TMOS POWER FET 25 AMPERES 500 VOLTS R DS(on) = 0.200 OHM CASE 433–01, Style PAK Surface Mount S ...
Page 2
... MTV25N50E ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( 500 Vdc Vdc 500 Vdc Vdc 125 C) Gate– ...
Page 3
... Figure 4. On–Resistance versus Drain Current 10000 1000 100 10 100 150 0 100 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–To–Source Leakage MTV25N50E 100 – DRAIN CURRENT (AMPS) ...
Page 4
... MTV25N50E Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...
Page 5
... DM ), the energy rating is specified at rated continuous cur- rent ( accordance with industry custom. The energy rat- ing must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at cur- rents below rated continuous I D can safely be assumed to equal the values indicated. MTV25N50E t d(off d(on) 10 ...
Page 6
... MTV25N50E 100 SINGLE PULSE 100 1.0 R DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.1 0.1 1 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 1.0E–05 1.0E–04 Figure 14. Diode Reverse Recovery Waveform ...
Page 7
... Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MTV25N50E Board Material = 0.0625 G–10/FR– Copper 5.0 Watts ...
Page 8
... MTV25N50E Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the SC–59, SC– ...
Page 9
... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 17. Typical Solder Heating Profile MTV25N50E STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 9 ...
Page 10
... BSC H 0.105 0.110 2.67 2.79 J 0.018 0.022 0.46 0.56 K 0.150 0.160 3.81 4.06 L 0.058 0.062 1.47 1.57 N 0.353 0.357 8.97 9.07 P 0.078 0.082 1.98 2.08 Q 0.053 0.057 1.35 1.45 R 0.623 0.627 15.82 15.93 S 0.313 0.317 7.95 8.05 U 0.028 0.032 0.71 0.81 V 0.050 ––– 1.27 ––– W 0.054 0.058 1.37 1.47 X 0.050 0.060 1.27 1.52 Y 0.104 0.108 2.64 2.74 STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN MTV25N50E/D ...