adg5409 Analog Devices, Inc., adg5409 Datasheet - Page 10

• Manufacturer Part Number: adg5409
• Description: High Voltage Latch-up Proof, 4-/8-channel Multiplexers Adg5408/adg5409
• Manufacturer: Analog Devices, Inc.

ADG5408/ADG5409
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Table 8. ADG5408 Pin Function Descriptions
TSSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Table 9. ADG5408 Truth Table
A2
X
0
0
0
0
1
1
1
1
Pin No.
LFCSP
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
EP
Figure 2. ADG5408 Pin Configuration (TSSOP)
V
EN
A0
S1
S2
S3
S4
SS
D
A1
X
0
0
1
1
0
0
1
1
1
2
3
4
5
6
7
8
(Not to Scale)
Mnemonic
A0
EN
V
S1
S2
S3
S4
D
S8
S7
S6
S5
V
GND
A2
A1
Exposed Pad
ADG5408
TOP VIEW
SS
DD
16
15
14
13
12
11
10
9
A1
A2
GND
V
S5
S6
S7
S8
Description
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
Source Terminal 1. This pin can be an input or an output.
Source Terminal 2. This pin can be an input or an output.
Source Terminal 3. This pin can be an input or an output.
Source Terminal 4. This pin can be an input or an output.
Drain Terminal. This pin can be an input or an output.
Source Terminal 8. This pin can be an input or an output.
Source Terminal 7. This pin can be an input or an output.
Source Terminal 6. This pin can be an input or an output.
Source Terminal 5. This pin can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
DD
A0
X
0
1
0
1
0
1
0
1
Rev. 0 | Page 10 of 24
EN
0
1
1
1
1
1
1
1
1
On Switch
None
1
2
3
4
5
6
7
8
Figure 3. ADG5408 Pin Configuration (LFCSP)
V
NOTES
1. THE EXPOSED PAD IS
S1
S2
S3
SS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
1
2
3
4
(Not to Scale)
ADG5408
TOP VIEW
PIN 1
INDICATOR
12 GND
11 V
10 S5
9 S6
DD
SS
.
SS
.