adg5409 Analog Devices, Inc., adg5409 Datasheet - Page 11

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adg5409

Manufacturer Part Number
adg5409
Description
High Voltage Latch-up Proof, 4-/8-channel Multiplexers Adg5408/adg5409
Manufacturer
Analog Devices, Inc.
Datasheet

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Table 10. ADG5409 Pin Function Descriptions
TSSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Table 11. ADG5409 Truth Table
A1
X
0
0
1
1
Pin No.
LFCSP
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
EP
Figure 4. ADG5409 Pin Configuration (TSSOP)
S1A
S2A
S3A
S4A
V
DA
EN
A0
A0
X
0
1
0
1
SS
1
2
3
4
5
6
7
8
Mnemonic
A0
EN
V
S1A
S2A
S3A
S4A
DA
DB
S4B
S3B
S2B
S1B
V
GND
A1
Exposed
Pad
SS
DD
(Not to Scale)
ADG5409
TOP VIEW
Description
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
Source Terminal 1A. This pin can be an input or an output.
Source Terminal 2A. This pin can be an input or an output.
Source Terminal 3A. This pin can be an input or an output.
Source Terminal 4A. This pin can be an input or an output.
Drain Terminal A. This pin can be an input or an output.
Drain Terminal B. This pin can be an input or an output.
Source Terminal 4B. This pin can be an input or an output.
Source Terminal 3B. This pin can be an input or an output.
Source Terminal 2B. This pin can be an input or an output.
Source Terminal 1B. This pin can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
The exposed pad is connected internally. For increased reliability of the solder joints and maximum
thermal capability, it is recommended that the pad be soldered to the substrate, V
16
15
14
13
12
11
10
9
A1
GND
V
S1B
S2B
S3B
S4B
DB
EN
0
1
1
1
1
DD
Rev. 0 | Page 11 of 24
On Switch Pair
None
1
2
3
4
Figure 5. ADG5409 Pin Configuration (LFCSP)
NOTES
1. THE EXPOSED PAD IS
S1A
S2A
S3A
V
SS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
1
2
3
4
(Not to Scale)
ADG5409
TOP VIEW
PIN 1
INDICATOR
ADG5408/ADG5409
12 V
11 S1B
10 S2B
9 S3B
DD
SS
SS
.
.

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