mk50x256cmb100 Freescale Semiconductor, Inc, mk50x256cmb100 Datasheet - Page 20

• Manufacturer Part Number: mk50x256cmb100
• Description: Arm Cortex-m4 Core With Dsp
• Manufacturer: Freescale Semiconductor, Inc

Peripheral operating requirements and behaviors
4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
5.3.2 Thermal attributes
1.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
20
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Four-layer
(2s2p)
—
—
—
1. output pins
Board
Symbol
type
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
• have C
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Die junction temperature
Ambient temperature
Description
L
=30pF loads,
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
Description
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table 9. Thermal operating requirements
Preliminary
TBD
TBD
TBD
TBD
TBD
TBD
TBD
MAPBGA
81
Min.
–40
–40
TBD
TBD
TBD
TBD
TBD
TBD
TBD
80 LQFP Unit
Freescale Semiconductor, Inc.
Max.
125
85
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1
1
1
1
2
3
4
Notes
Unit
°C
°C