w25p16 Winbond Electronics Corp America, w25p16 Datasheet - Page 3

• Manufacturer Part Number: w25p16
• Description: 8m-bit And 16m-bit Serial Flash Memory
• Manufacturer: Winbond Electronics Corp America

10.
11.
12.
13.
ELECTRICAL CHARACTERISTICS......................................................................................... 32
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
PACKAGE SPECIFICATION .................................................................................................... 39
11.1
11.2
ORDERING INFORMATION .................................................................................................... 41
REVISION HISTORY ................................................................................................................ 42
9.2.8
9.2.9
9.2.10
9.2.11
9.2.12
9.2.13
9.2.14
9.2.15
9.2.16
9.2.17
9.2.18
Absolute Maximum Ratings (1) .................................................................................... 32
Operating Ranges......................................................................................................... 32
Power-up Timing and Write Inhibit Threshold .............................................................. 33
DC Electrical Characteristics (Preliminary) (1) .............................................................. 34
AC Measurement Conditions........................................................................................ 35
AC Electrical Characteristics ........................................................................................ 36
Serial Output Timing ..................................................................................................... 38
Input Timing .................................................................................................................. 38
Hold Timing................................................................................................................... 38
8-Pin SOIC 208-mil (Winbond Package Code SS)....................................................... 39
16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 40
Page Program (02h) .......................................................................................................20
Sector Erase (D8h).........................................................................................................21
Chip Erase (C7h)..........................................................................................................22
Power-down (B9h) ........................................................................................................23
Release Power-down / Device ID (ABh) .......................................................................23
Read Manufacturer / Device ID (90h) ...........................................................................25
JEDEC ID (9Fh) ...........................................................................................................26
Read Parameter Page (53h) ........................................................................................27
Fast Read Parameter Page (5Bh) ................................................................................28
Program Parameter Page (52h) ...................................................................................29
Erase Parameter Page (D5h) .......................................................................................31
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Publication Release Date: September 22, 2006
W25P80 AND W25P16
Revision L