w25p16 Winbond Electronics Corp America, w25p16 Datasheet - Page 39

• Manufacturer Part Number: w25p16
• Description: 8m-bit And 16m-bit Serial Flash Memory
• Manufacturer: Winbond Electronics Corp America

11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 208-mil (Winbond Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
A1
A2
E1
C
D
A
E
b
e
L
6
y
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
0.50
MIN
MILLIMETERS
---
0
o
1.27 BSC
MAX
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.80
0.10
8
o
- 39 -
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.020
Publication Release Date: September 22, 2006
W25P80 AND W25P16
MIN
---
0
0.050 BSC
o
INCHES
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
0.031
0.004
MAX
8
o
Revision L