hip1011d Intersil Corporation, hip1011d Datasheet - Page 15

• Manufacturer Part Number: hip1011d
• Description: Dual Plug Controller
• Manufacturer: Intersil Corporation

Shrink Small Outline Plastic Packages (SSOP)
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: [phone]
FAX: [phone]
NOTES:
10. Controlling dimension: INCHES. Converted millimeter dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual in-
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
0.17(0.007)
of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch)
per side.
dex feature must be located within the crosshatched area.
bar protrusion shall be 0.10mm (0.004 inch) total in excess of “B”
dimension at maximum material condition.
are not necessarily exact.
2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
15
For information regarding Intersil Corporation and its products, see web site www.intersil.com
A1
H
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: [phone]
FAX: [phone]
A2
0.010
M
0.25
h x 45
B
M
o
L
C
HIP1011D
M28.15
28 LEAD SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
SYMBOL
A1
A2
A
B
C
D
E
H
N
e
h
L
0.053
0.004
0.008
0.007
0.386
0.150
0.228
0.0099
0.016
MIN
0
-
0.025 BSC
o
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: [phone]
FAX: [phone]
INCHES
28
0.069
0.010
0.061
0.012
0.010
0.394
0.157
0.244
0.0196
0.050
MAX
8
o
MILLIMETERS
1.35
0.10
0.20
0.18
9.81
3.81
5.80
0.26
0.41
MIN
0
-
0.635 BSC
o
28
10.00
MAX
1.75
0.25
0.30
0.25
3.98
6.19
0.49
1.27
1.54
8
o
Rev. 0 2/95
NOTES
9
3
4
5
6
7
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