a54sx16p Actel Corporation, a54sx16p Datasheet - Page 24

• Manufacturer Part Number: a54sx16p
• Description: Sx Family Fpgas
• Manufacturer: Actel Corporation

Table 1-15 • Package Thermal Characteristics
Table 1-16 • Temperature and Voltage Derating Factors*
1 -2 0
Package Type
Plastic Leaded Chip Carrier (PLCC)
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Very Thin Quad Flatpack (VQFP)
Plastic Quad Flat Pack (PQFP) without Heat Spreader
Plastic Quad Flat Pack (PQFP) with Heat Spreader
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Fine Pitch Ball Grid Array (FBGA)
Note: SX08 does not have a heat spreader.
Note: *Normalized to worst-case commercial, T
SX Family FPGAs
V
3.0
3.3
3.6
CCA
0.75
0.70
0.66
–55
0.78
0.73
0.69
–40
J
= 70°C, V
CCA
0.87
0.82
0.77
0
= 3.0 V
Junction Temperature
Pin Count
v3.2
144
176
100
208
208
272
313
329
144
84
0.89
0.83
0.78
25
3.8
3.8
θ
12
11
11
10
8
3
3
3
jc
1.00
0.93
0.87
70
Still Air
38.8
θ
32
32
28
38
30
20
20
23
18
ja
300 ft/min.
1.04
0.97
0.92
85
26.7
14.5
13.5
θ
24
21
22
32
23
17
17
ja
1.16
1.08
1.02
125
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W