bs62lv8003bi Brillance Semiconductor, bs62lv8003bi Datasheet

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bs62lv8003bi

Manufacturer Part Number
bs62lv8003bi
Description
Very Power/voltage Cmos Sram
Manufacturer
Brillance Semiconductor
Datasheet
R0201-BS62LV8003
• Wide Vcc operation voltage : 2.4V ~ 3.6V
• Very low power consumption :
• High speed access time :
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE1, CE2 and OE options
BS62LV8003EC
BS62LV8003BC
BS62LV8003EI
BS62LV8003BI
PIN CONFIGURATIONS
PRODUCT FAMILY
Brilliance Semiconductor Inc
FEATURES
GND
DQ0
DQ1
VCC
DQ2
DQ3
CE1
Vcc = 3V
-70
-10
A19
A18
A17
A16
A15
A
B
C
D
E
F
G
H
NC
NC
NC
NC
WE
A4
A3
A2
A1
A0
PRODUCT
48-Ball CSP top View
FAMILY
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
VCC
VSS
A18
1
NC
D0
D3
NC
BSI
NC
100ns (Max) at Vcc = 3V
70ns (Max) at Vcc = 3V
BS62LV8003EC
BS62LV8003EI
OE
2
D2
NC
NC
A8
NC
NC
D1
C-grade: 20mA (Max.) operating current
I -grade: 25mA (Max.) operating current
0.5uA (Typ.) CMOS standby current
VCC
A17
A14
A12
3
A0
A3
A5
A9
-40
TEMPERATURE
+0
A16
A15
A13
A10
4
A1
A4
A6
A7
OPERATING
O
O
C to +70
C to +85
Very Low Power/Voltage CMOS SRAM
1M X 8 bit
WE
A11
5
A2
CE1
D6
NC
D5
NC
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
CE2
VCC
VSS
A19
6
NC
D4
NC
A5
A6
A7
OE
CE2
A8
NC
NC
DQ7
DQ6
GND
VCC
DQ5
DQ4
NC
NC
A9
A10
A11
A12
A13
A14
D7
O
O
C
C
. reserves the right to modify document contents without notice.
2.4V ~ 3.6V
2.4V ~ 3.6V
RANGE
Vcc
70 / 100
70 / 100
SPEED
Vcc=3V
( ns )
The BS62LV8003 is a high performance, very low power CMOS
Static Random Access Memory organized as 1,048,576 words by 8 bits
and operates from a wide range of 2.4V to 3.6V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current of
0.5uA and maximum access time of 70ns in 3V operation.
Easy memory expansion is provided by an active LOW chip
enable (CE1), an active HIGH chip enable(CE2) and active LOW output
enable (OE) and three-state output drivers.
The BS62LV8003 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS62LV8003 is available in 44 pin TSOP2 and 48-pin BGA type.
FUNCTIONAL BLOCK DIAGRAM
1
A13
A17
A15
A18
A16
A14
A12
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
GENERAL DESCRIPTION
CE1
Vdd
Gnd
CE2
A7
A6
A5
A4
WE
OE
Address
Buffer
Input
( I
STANDBY
CCSB1
8
Control
8
Vcc=3V
POWER DISSIPATION
3uA
6uA
, Max )
22
Output
Buffer
Buffer
Data
Input
Data
Decoder
Row
Operating
8
( I
2048
8
Vcc=3V
CC
20mA
25mA
A11A9 A8 A3 A2 A1 A0A10 A19
, Max )
BS62LV8003
Address Input Buffer
Column Decoder
Memory Array
2048 X 4096
Write Driver
Sense Amp
Column I/O
4096
512
18
TSOP2-44
BGA-48-0810
TSOP2-44
BGA-48-0810
PKG TYPE
Revision 2.4
April 2002

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bs62lv8003bi Summary of contents

Page 1

... Fully static operation • Data retention supply voltage as low as 1.5V • Easy expansion with CE1, CE2 and OE options PRODUCT FAMILY PRODUCT OPERATING FAMILY TEMPERATURE BS62LV8003EC +70 BS62LV8003BC BS62LV8003EI O - +85 BS62LV8003BI PIN CONFIGURATIONS ...

Page 2

BSI PIN DESCRIPTIONS Name A0-A19 Address Input CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input WE Write Enable Input OE Output Enable Input DQ0-DQ7 Data Input/Output Ports Vcc Gnd TRUTH TABLE MODE WE X Not selected (Power Down) ...

Page 3

BSI DC ELECTRICAL CHARACTERISTICS PARAMETER PARAMETER NAME Guaranteed Input Low V IL (2) Voltage Guaranteed Input High V IH (2) Voltage I Input Leakage Current IL I Output Leakage Current OL V Output Low Voltage OL V Output High Voltage ...

Page 4

BSI AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level AC TEST LOADS AND WAVEFORMS Ω 1269 3.3V OUTPUT 100PF INCLUDING Ω 1404 JIG AND SCOPE FIGURE 1A THEVENIN EQUIVALENT 667 OUTPUT ...

Page 5

BSI SWITCHING WAVEFORMS (READ CYCLE (1,2,4) READ CYCLE1 ADDRESS D OUT READ CYCLE2 (1,3,4) CE2 CE1 D OUT (1,4) READ CYCLE3 ADDRESS OE CE2 CE1 D OUT NOTES high in read Cycle. 2. Device is continuously selected ...

Page 6

BSI AC ELECTRICAL CHARACTERISTICS WRITE CYCLE JEDEC PARAMETER PARAMETER NAME NAME t t AVAX E1LWH AVW AVWH WLWH WHAX WLOZ WHZ ...

Page 7

BSI (1,6) WRITE CYCLE2 ADDRESS CE2 CE1 WE D OUT D IN NOTES must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE2, CE1 and WE low. ...

Page 8

BSI ORDERING INFORMATION BS62LV8003 PACKAGE DIMENSIONS TSOP2-44 R0201-BS62LV8003 BS62LV8003 SPEED 70: 70ns 10: 100ns GRADE + - + PACKAGE E: TSOP2-44 B: ...

Page 9

BSI PACKAGE DIMENSIONS (continued) SIDE VIEW D 0.1 D1 VIEW A 48 mini-BGA (8 x 10mm) R0201-BS62LV8003 NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF ...

Page 10

BSI REVISION HISTORY Revision Description 2.2 2001 Data Sheet release 2.3 Modify Standby Current (Typ. and Max.) 2.4 Modify some AC parameters R0201-BS62LV8003 Date Apr. 15, 2001 Jun. 29, 2001 April,11,2002 10 BS62LV8003 Note Revision 2.4 April 2002 ...

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