hi-3182ps Holt Integrated Circuits, Inc., hi-3182ps Datasheet - Page 9

• Manufacturer Part Number: hi-3182ps
• Description: Arinc 429 Differential Line Driver
• Manufacturer: Holt Integrated Circuits, Inc.

BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
16-PIN CERAMIC SIDE-BRAZED DIP
(10.34 ± .32)
.407 ± .013
(1.27)
.050
BSC
(10.287 ± .20)
.405 ± .008
(3.175)
Top View
.125
min
.0165 ± .003
(.419 ± .089)
(5.080)
(.457 ±.051)
.200
.018 ± .002
HOLT INTEGRATED CIRCUITS
PIN 1
max
.295 ± .004
(7.49 ± .10)
(20.574)
0° to 8°
.810
See Detail A
max
.0105 ± .0015
HI-318X PACKAGE DIMENSIONS
(.2667 ± .038)
(1.270 ±.127)
9
(2.54)
.050 ±.005
.100
(.889 ±.254)
.035 ± .010
(.838 ± .432)
.033 ± .017
BSC
SEATING
PLANE
(7.493 ±.254)
.295 ±.010
PLANE
BASE
(4.83)
.190
Detail A
(7.620 ±.254)
typ
.300 ± .010
(2.286 ± .254)
.090 ± .010
inches (millimeters)
Package Type: 16HWE
inches (millimeters)
Package Type: 16C
.0025 ± .002
(.064 ± .038)
(.254 ±.051)
Bottom
.010 ±.002
(6.10)
View
.240
typ
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.