maapss0111 M/A-COM, maapss0111 Datasheet - Page 3

• Manufacturer Part Number: maapss0111
• Description: 1.25 W Vsat Power Amplifier 13.75-14.5 Ghz -
• Manufacturer: M/A-COM

3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
1.25 W VSAT Power Amplifier
13.75—14.5 GHz
External Parts List
Evaluation Test Board
Notes on board design:
1.
2.
3.
4.
5.
6.
7.
8.
Designator
A low loss dielectric material such as Rogers 4003, e
A substrate thickness of 20 mils (0.508 mm) maximum is recommended to minimize thermal resistance and
ground impedances.
RF transmission line impedance must be 50 ohms (w = 42 mils (1.0668 mm) for t = 20 mils (0.508 mm),
Rogers 4003).
The board must provide low thermal resistance from package base to heat sink to accommodate the 3 W
typical power dissipation.
Metal foil thickness in the vias is critical to thermal resistance. The recommended metalization is 1 oz
(35 mm minimum thickness).
The application board is configured with 36 vias, each 12 mil (0.3048 mm) in diameter beneath the package
base. Conductive via fill material is recommended to minimize thermal resistance and to prevent solder from
wicking into vias.
The exposed package pad must be properly soldered to the board.
Case temperature is measured at the interface between the package bottom and circuit board.
C1, C10
C2, C9
C3, C8
C4, C7
C5, C6
Value
100 pF
0.1 uF
10 pF
10 uF
1 uF
Foot Print
0402
0402
0804
0402
0402
r
= 3.38, is recommended for this application.
Compliant
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Visit www.macom.com for additional data sheets and product information.
Cross Section View
RoHS
MAAPSS0111
V2P