hmc570lc5 Hittite Microwave Corporation, hmc570lc5 Datasheet

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hmc570lc5

Manufacturer Part Number
hmc570lc5
Description
Gaas Mmic I/q Downconverter 17 - 21 Ghz
Manufacturer
Hittite Microwave Corporation
Datasheet

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HMC570LC5
Manufacturer:
RFMD
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Part Number:
HMC570LC5
Manufacturer:
HITTITE
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8 - 166
8
Typical Applications
The HMC570LC5 is ideal for:
• Point-to-Point and Point-to-Multi-Point Radio
• Military Radar, EW & ELINT
• Satellite Communications
Functional Diagram
Electrical Specifi cations,
Frequency Range, RF
Frequency Range, LO
Frequency Range, IF
Conversion Gain (As IRM)
Noise Figure
Image Rejection
1 dB Compression (Input)
2 LO to RF Isolation
2 LO to IF Isolation
IP3 (Input)
Amplitude Balance
Phase Balance
Total Supply Current
*Data taken as IRM with external IF Hybrid
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Parameter
T
A
v02.1106
= +25° C, IF = 100 MHz, LO = +4 dBm, Vdd = 3.5 Vdc*
Order On-line at www.hittite.com
Min.
6.5
14
55
35
-5
-5
17.7 - 19.7
DC - 3.5
7 - 12
Typ.
125
8.5
0.5
70
50
17
-4
12
-2
3
GaAs MMIC I/Q DOWNCONVERTER
Features
10 dB Conversion Gain
Image Rejection: 18 dB
2 LO to RF Isolation: 65 dB
Noise Figure: 3 dB
Input IP3: +2 dBm
RoHS Compliant 5x5 mm SMT Package
General Description
The HMC570LC5 is a compact GaAs MMIC I/Q
downconverter in a leadless RoHS compliant
SMT package. This device provides a small signal
conversion gain of 10 dB with a noise fi gure of 3 dB
and 18 dB of image rejection across the frequency
band. The HMC570LC5 utilizes an LNA followed by
an image reject mixer which is driven by an active x2
multiplier. The image reject mixer eliminates the need
for a fi lter following the LNA, and removes thermal
noise at the image frequency. I and Q mixer outputs
are provided and an external 90° hybrid is needed to
select the required sideband. The HMC570LC5 is a
much smaller alternative to hybrid style image reject
mixer downconverter assemblies, and it eliminates the
need for wire bonding by allowing the use of surface
mount manufacturing techniques.
Max.
150
Min.
-10
15
50
35
-5
9
HMC570LC5
DC - 3.5
17 - 21
7 - 12
Typ.
125
0.5
11
22
60
45
+2
-5
4
4
Max.
17 - 21 GHz
150
Units
GHz
GHz
GHz
dBm
dBm
Deg
mA
dB
dB
dB
dB
dB
dB

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hmc570lc5 Summary of contents

Page 1

... LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC570LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques ...

Page 2

... Input IP3 vs. LO Drive -10 -15 - Order On-line at www.hittite.com HMC570LC5 GHz +25C +85C -40C FREQUENCY (GHz FREQUENCY (GHz dBm dBm dBm dBm ...

Page 3

... Phase Balance vs. LO Drive dBm dBm dBm dBm dBm Noise Figure vs. LO Drive, IF Frequency = 100 MHz 2.5 3 3.5 4 Order On-line at www.hittite.com HMC570LC5 GHz CONVERSION GAIN RETURN LOSS 0 -5 -10 -15 -20 0.5 1 1 FREQUENCY (GHz) ...

Page 4

... GOLD OVER 50 MICROINCHES MINIMUM NICKLE 3. DIMENSIONS ARE IN INCHES [MILLIMETERS] 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND Order On-line at www.hittite.com HMC570LC5 GHz +2 dBm + 13 dBm 5.5V 175°C 860 mW ...

Page 5

... For operation to DC, this pin must not sink / source more than current or part non-function and possible failure will result. This pin is AC coupled and matched to 50 Ohms from GHz. Order On-line at www.hittite.com HMC570LC5 GHz Interface Schematic ...

Page 6

... A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Order On-line at www.hittite.com HMC570LC5 GHz 171 ...

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