FMS2024_1 FILTRONIC [Filtronic Compound Semiconductors], FMS2024_1 Datasheet - Page 5

• Manufacturer Part Number: FMS2024_1
• Description: DC-20 GHZ MMIC SPDT REFLECTIVE SWITCH
• Manufacturer: FILTRONIC [Filtronic Compound Semiconductors]

P
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of solder or conductive epoxy. If epoxy is
selected then it should be applied to the
attachment surface uniformly and sparingly to
avoid encroachment of epoxy on to the top
face of the die and ideally should not exceed
half the chip height. For automated dispense
Ablestick LMISR4 is recommended and for
manual dispense Ablestick 84-1 LMI or 84-1
LMIT are recommended.
cured at a temperature of 150°C for 1 hour in
an oven especially set aside for epoxy curing
only.
flushed with dry nitrogen.
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4µm diameter gold wire
be
preferred. A nominal stage temperature of
150°C and a bonding force of 40g has been
shown to give effective results for 25µm wire.
Ultrasonic energy shall be kept to a minimum.
For this bonding technique, stage temperature
should not be raised above 200°C and bond
force should not be raised above 60g.
Thermosonic
thermocompression wedge bonding can also
be used to achieve good wire bonds.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
Tel: [phone]
REFERRED
used.
If possible the curing oven should be
Thermosonic
A
SSEMBLY
wedge
I
NSTRUCTIONS
Fax: [phone]
ball
These should be
bonding
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
bonding
:
and
is
5
Email: [e-mail]
H
P
To avoid damage to the devices care should
be
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing.
devices should be treated as Class 1A (250-
500 V) as defined in JEDEC Standard No. 22-
A114.
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
A
Application Notes and design data including S-
parameters are available on request.
D
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
O
RECAUTIONS
PPLICATION
ANDLING
ISCLAIMERS
RDERING
P
ART
exercised
FMS2024-000
Further information on ESD control
N
UMBER
I
NFORMATION
:
N
:
OTES
during
& D
Website:
(Gel-pak available on request)
handling.
:
D
ESIGN
Die in Waffle-pack
FMS2024
ESCRIPTION
Production Datasheet v3.0
www.filtronic.com
D
ATA
Proper
These
: