FMS2007-000-EB FILTRONIC [Filtronic Compound Semiconductors], FMS2007-000-EB Datasheet
FMS2007-000-EB
Related parts for FMS2007-000-EB
FMS2007-000-EB Summary of contents
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... Filtronic Advanced GaAs pHEMT Technology Description and Applications: The FMS2007 is a low loss linear Double-Pole Double-Throw dual band diversity switch designed for use in WLAN applications. Typical applications are for UNII, Hiperlan, 802.11a and 802.11b/g systems that employ two antennas for transmit and receive diversity. ...
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... LOW LOW HIGH LOW LOW LOW HIGH LOW LOW LOW HIGH HIGH LOW HIGH LOW HIGH LOW 2 Filtronic Compound Semiconductors Ltd Fax: +1 (408) 850 5766 Website: www.filcs.com FMS2007 PATH(S) RX-ANT1 RX-ANT2 TX-ANT2 TX-ANT1 TX-ANT1 & RX-ANT2 TX-ANT2 & RX-ANT1 Email: sales@filcsi.com ...
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... Receive Ground Transmit Ground RX-Ant2 Tx-Ant1 Min. Bond Pad Pitch(µm) 150 127 3 Filtronic Compound Semiconductors Ltd Fax: +1 (408) 850 5766 Website: www.filcs.com FMS2007 Pin Coordinates (x µm, y µm) (142.1 , 709.0) (142.1 , 581.6) (142.1 , 448.5) (142.1 ,327.9) (142.1 , 201.4) (349.8 , 88.5) (522 ...
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... Preliminary Data Sheet A1-TX Isolation -20 -25 -30 -35 -40 -45 4.5 5 5.5 6 0.5 1 1.5 2 Return Loss 0 -10 -20 -30 -40 -50 -60 4.5 5 5.5 6 0.5 1 1.5 RX-TX Isolation -20 -30 -40 -50 -60 4.5 5 5.5 6 0 Fax: +1 (408) 850 5766 Website: www.filcs.com FMS2007 2.5 3 3.5 4 4.5 5 5.5 6 Frequency (GHz) 2 2.5 3 3.5 4 4.5 5 5.5 6 Frequency (GHz) 2.5 3 3.5 4 4.5 5 5.5 6 Frequency (GHz) Email: sales@filss.com ...
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... Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 2.2 Preliminary Data Sheet BOM Label 0.25dB 0.80dB 5 Fax: +1 (408) 850 5766 Website: www.filcs.com FMS2007 Component Capacitor, 100pF, 0603 Capacitor, 47pF, 0402 Email: sales@filss.com ...
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... Ordering Information: Part Number FMS2007-000-WP FMS2007-000-GP FMS2007-000-EB FMS2007-000-FF Preferred Assembly Instructions: GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is not metallised and the recommended mounting method is by the use of conductive epoxy ...