PALCE16V8H-10JC Advanced Micro Devices, PALCE16V8H-10JC Datasheet - Page 26

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PALCE16V8H-10JC

Manufacturer Part Number
PALCE16V8H-10JC
Description
EE CMOS 20-Pin Universal Programmable Array Logic
Manufacturer
Advanced Micro Devices
Datasheet

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TYPICAL THERMAL CHARACTERISTICS
/4 Devices (PALCE16V8H-10/4)
Measured at 25 C ambient. These parameters are not tested.
/5 Devices (PALCE16V8H-7/5)
Measured at 25 C ambient. These parameters are not tested.
Plastic jc Considerations
The data listed for plastic jc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the jc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore, jc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
Parameter
Parameter
Symbol
Symbol
jma
jma
ja
ja
jc
jc
Parameter Description
Thermal Impedance, Junction to Case
Thermal Impedance, Junction to Ambient
Thermal Impedance, Junction to Ambient with Air Flow
Parameter Description
Thermal Impedance, Junction to Case
Thermal Impedance, Junction to Ambient
Thermal Impedance, Junction to Ambient with Air Flow
PALCE16V8 Family
200 Ifpm air
400 Ifpm air
600 Ifpm air
800 Ifpm air
200 Ifpm air
400 Ifpm air
600 Ifpm air
800 Ifpm air
PDIP
PDIP
25
71
61
55
51
47
29
70
64
58
53
X
Typ
Typ
PLCC
PLCC
22
64
55
51
47
45
23
61
53
47
44
X
AMD
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
2-61

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