25LC640-E/ST MICROCHIP [Microchip Technology], 25LC640-E/ST Datasheet - Page 21

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25LC640-E/ST

Manufacturer Part Number
25LC640-E/ST
Description
64K SPI Bus Serial EEPROM
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
 2004 Microchip Technology Inc.
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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Device
Temperature Range
Package
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
PART NO.
Device
Temperature
25AA640:
25AA640T:
25AA640X:
25AA640XT: 64K bit 1.8V SPI Serial EEPROM
25LC640:
25LC640T:
25LC640X:
25LC640XT: 64K bit 2.5V SPI Serial EEPROM
I
E
P
SN
ST
Range
X
=
=
=
=
=
-40 C to +85 C
-40 C to +125 C
64K bit 1.8V SPI Serial EEPROM
64K bit 1.8V SPI Serial EEPROM
(Tape and Reel)
64K bit 1.8V SPI Serial EEPROM
in alternate pinout (ST only)
in alternate pinout Tape and Reel (ST only)
64K bit 2.5V SPI Serial EEPROM
64K bit 2.5V SPI Serial EEPROM
(Tape and Reel)
64K bit 2.5V SPI Serial EEPROM
in alternate pinout (ST only)
in alternate pinout Tape and Reel (ST only)
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC (150 mil Body), 8-lead
Plastic TSSOP (4.4 mm Body), 8-lead
Package
/XX
25AA640/25LC640
Examples:
a)
b)
c)
d)
e)
f)
25AA640-I/SN: Industrial Temp.,
SOIC package
25AA640T-I/SN: Tape and Reel,
Industrial Temp., SOIC package
25AA640X-I/ST: Alternate Pinout
Industrial Temp., TSSOP package
25LC640-I/SN: Industrial Temp.,
SOIC package
25LC640T-I/SN: Tape and Reel,
Industrial Temp., SOIC package
25LC640X-I/ST: Alternate Pinout,
Industrial Temp., TSSOP package
DS21223G-page 21

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