LM6121J/883 National Semiconductor, LM6121J/883 Datasheet - Page 4

• Manufacturer Part Number: LM6121J/883
• Description: High Speed Buffer
• Manufacturer: National Semiconductor

www.national.com
SR
SR
SR
BW
t
t
O
Symbol
r
pd
The following specifications apply for Supply Voltage =
Boldface limits apply for T
, t
AC Electrical Characteristics
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its rated operating conditions.
Note 2: During current limit or thermal limit, the input current will increase if the input to output differential voltage exceeds 8V. For input to output differential voltages
in excess of 8V the input current should be limited to
Note 3: The LM6121 series buffers contain current limit and thermal shutdown to protect against fault conditions.
Note 4: The thermal resistance
4, 5 and 8) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal resistance
sistance
connected to 1 square inch of 2 oz. copper.
Note 5: Limits are guaranteed by testing or correlation.
Note 6: The input is biased to 2.5V and V
reduced to 1.5 V
Note 7: Slew rate is measured with a
will be approximately
device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to
at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/µs.
Note 8: The test circuit consists of the human body model of 120 pF in series with 1500 .
Note 9: For specification limits over the full Military Temperature Range, see RETS6121X.
Note 10: The maximum power dissipation is a function of T
(T
Typical Performance Characteristics
Frequency Response
S
J(max)
1
2
3
f
–T
JA
A
)/
of the device in the M package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1, 2, 6, 7, 8, 9, 13, 14) are
JA
Slew Rate 1
Slew Rate 2
Slew Rate 3
−3 dB Bandwidth
Rise Time
Fall Time
Propagation
Delay Time
Overshoot
.
pp
.
Parameter
±
10V. Slew rate is calculated for transitions between
JA
A
of the device in the N package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1,
= T
±
DS009223-11
11V input pulse and 50
J
IN
= T
V
V
(Note 7)
V
V
V
C
R
V
R
V
R
V
swings V
IN
IN
IN
+
IN
O
O
O
L
L
L
L
= 5V (Note 6)
= 50 , C
= 50 , C
= 50 , C
MIN
= 100 mV
= 100 mV
= 100 mV
=
=
= 2 V
=
10 pF
±
±
±
to T
11V, R
11V, R
100 mV
±
pp
Conditions
20 mA.
PP
Frequency Response
about this value. The input swing is 2 V
MAX
, R
L
L
L
PP
PP
PP
J(max)
L
L
L
; all other limits T
PP
10 pF
10 pF
10 pF
= 1 k
= 50
= 50
source impedance at 25˚C. Since voltage gain is typically 0.9 driving a 50
, R
,
JA
L
±
, and T
= 50
15V, V
±
5V levels on both rising and falling edges. A high speed measurement is done to minimize
A
T
. The maximum allowable power dissipation at any ambient temperature is P
4
J
CM
= 25˚C, unless otherwise specified
A
= 0, R
1200
= T
Typ
800
7.0
4.0
50
50
10
J
= 25˚C.
DS009223-12
L
pp
at all temperatures except for the A
100 k
LM6121
(Note 5)
Limit
550
550
550
30
and R
Slew Rate vs Temperature
JA
S
of the N package is 84˚C/W. The thermal re-
= 50
LM6221
(Note 5)
Limit
550
550
550
30
unless otherwise noted.
V
3 test at −55˚C where it is
±
10V for measurements
LM6321
(Note 5)
load, the output swing
Limit
550
550
550
30
DS009223-13
Units
V/µs
MHz
Min
Min
D
ns
ns
%
=