LM6121J/883 National Semiconductor, LM6121J/883 Datasheet - Page 7

• Manufacturer Part Number: LM6121J/883
• Description: High Speed Buffer
• Manufacturer: National Semiconductor

Application Hints
The heatsink for the LM6321 is made using the PC board
copper. The heat is conducted from the die, through the lead
frame (inside the part), and out the pins which are soldered
to the PC board. The pins used for heat conduction are:
Figure 3 shows copper patterns which may be used to dissi-
pate heat from the LM6321.
LM6321N
LM6321M
Part
14-Pin SO
8-Pin DIP
Package
TABLE 1.
(Continued)
1, 2, 3, 6, 7,
8, 9, 13, 14
1, 4, 5, 8
Pins
7
*For best results, use L = 2H
Table 2 shows some values of junction-to-ambient thermal
resistance (
14-Pin SO
8-Pin DIP
Package
FIGURE 3. Copper Heatsink Patterns
J–A
) for values of L and W for 2 oz. copper:
L (in.)
2
1
2
14-Pin SO
8-Pin DIP
TABLE 2.
H (in.)
0.5
0.5
DS009223-10
1
DS009223-9
J–A
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