AS5215-HQFT-OM AMSCO [austriamicrosystems AG], AS5215-HQFT-OM Datasheet - Page 5

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AS5215-HQFT-OM

Manufacturer Part Number
AS5215-HQFT-OM
Description
Manufacturer
AMSCO [austriamicrosystems AG]
Datasheet
AS5215
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
the device at these or any other conditions beyond those indicated in
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
www.austriamicrosystems.com/AS5215
Input current (latchup immunity), I_scr
Package body temperature (T_body)
Package thermal resistance (Θ_JA)
Electrostatic discharge (ESD)
Storage temperature (T_strg)
Total power dissipation (P
Humidity non-condensing
Input pin voltage (V_in)
Supply voltage (V
Parameter
DD
Table 2
)
tot
)
may cause permanent damage to the device. These are stress ratings only, and functional operation of
V
SS
-100
Min
-0.3
-65
5
- 0.5
Max
100
275
150
260
±2
27
85
7
7
Revision 1.9
Electrical Characteristics on page 6
Units
ºC/W
mW
mA
kV
ºC
ºC
%
V
V
The reflow peak soldering temperature (body temperature)
Velocity =0; Multi Layer PCB; Jedec Standard Testboard
specified is in accordance with IPC/JEDEC J-STD-020C
The lead finish for Pb-free leaded packages is matte tin
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
Norm: EIA/JESD78 Class II Level A
Norm: IPC/JEDEC J-STD-020C.
Norm: JESD22-A114E
is not implied. Exposure to absolute
Comments
(100% Sn).
MSL = 3
5 - 24

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