92HD700DX5PRGXYYX IDT [Integrated Device Technology], 92HD700DX5PRGXYYX Datasheet - Page 178

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92HD700DX5PRGXYYX

Manufacturer Part Number
92HD700DX5PRGXYYX
Description
10-CHANNEL HIGH DEFINITION AUDIO CODEC
Manufacturer
IDT [Integrated Device Technology]
Datasheet
10. SOLDER REFLOW PROFILE
IDT™
92HD700
10-CHANNEL HIGH DEFINITION AUDIO CODEC
Time maintained above
10.1. Standard Reflow Profile Data
Time within 5
10-CHANNEL HIGH DEFINITION AUDIO CODEC
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Note: All temperatures refer to topside of the package, measured on the package body surface.
Peak / Classification Temperature (Tp)
Preheat
Average Ramp-Up Rate (Ts
o
Profile Feature
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
min
max
Time (t
Figure 5. Solder Reflow Profile
- ts
- Tp)
max
max
min
L
L
IDT CONFIDENTIAL
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
on page 179.
20 - 40 seconds
6
8 minutes max
o
C for 3 to 5 seconds.
o
o
C / second max
C / second max
178
o
o
o
C
C
C
Pb Free Assembly
92HD700
PC AUDIO
V 1.2 112006

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