HFCT-5760ANP HP [Agilent(Hewlett-Packard)], HFCT-5760ANP Datasheet - Page 3

• Manufacturer Part Number: HFCT-5760ANP
• Description: Single Mode OC-3/STM-1 Small Form Factor Pluggable Transceivers
• Manufacturer: HP [Agilent(Hewlett-Packard)]

Module Description
The transceiver meets the Small
Form Pluggable (SFP) industry
standard package utilizing an
integral LC-Duplex optical
interface connector. The hot-
pluggable capability of the SFP
package allows the module to be
installed at any time - with the
host system operating and on-
line. This allows for system
configuration changes or
maintenance without system
down time. The HFCT-5760xxx
uses a reliable 1300 nm FP laser
source and requires a 3.3 V dc
power supply for optimal design.
Figure 2. Recommended application configuration
Figure 3. MSA required power supply filter
3
PROTOCOL
NOTE: INDUCTORS MUST HAVE LESS THAN 1 Ω SERIES RESISTANCE PER MSA.
SFP MODULE
IC
Tx_FAULT
Rx_LOS
Tx Dis
V
V
CC
CC
R
T
3.3 V
0.1 µF
0.1 µF
PC MASTER
3.3 V
4.7 K to 10 K
10 µF
SOñ
SO+
SI+
SIñ
HOST BOARD
10 µF
0.1 µF
4.7 K to 10 K
4.7 K to
10 K
50 W
50 W
50 W
50 W
Module Diagrams
Figure 1 illustrates the major
functional components of the
HFCT-5760xxx. The connection
diagram of the module is shown
in Figure 4. Figure 2 depicts the
external configuration of the
module. Figure 3 depicts the
MSA recommended power
supply filter.
4.7 K to
10 K
1 µH
1 µH
1 µH
1 µH
10 µF
4.7 K to
10 K
Tx_DISABLE
Tx_FAULT
MOD_DEF2
MOD_DEF1
MOD_DEF0
0.1 µF
3.3 V
Rx_LOS
RDñ
TD+
TDñ
RD+
0.1
RX GND
TX GND
µF
V
0.1 µF
CC
,T
V
CC
0.01 µF
0.01 µF
0.01 µF
0.01 µF
,R
4.7 K to 10 K
100
100
10 µF
HFCT-5760xx
AMPLIFICATION
LASER DRIVER
QUANTIZATION
EEPROM
CIRCUITRY
& SAFETY
&
3.3 V
Installation
The HFCT-5760xxx can be
installed in or removed from any
Multisource Agreement (MSA) -
compliant Small Form Pluggable
port regardless of whether the
host equipment is operating or
not. The module is simply
inserted, electrical interface
first, under finger pressure.
Controlled hot-plugging is
ensured by design and by 3-
stage pin sequencing at the
electrical interface. The module
housing makes initial contact
with the host board EMI shield
mitigating potential damage due
to Electro-Static Discharge
(ESD). The 3-stage pin contact
sequencing involves (1) Ground,
(2) Power, and then (3) Signal
pins, making contact with the
host board surface mount
connector in that order.
Figure 4. Connection diagram of module
printed circuit board
20
19
18
17
16
15
14
13
12
11
TOP OF BOARD
V
TD-
TD+
V
V
V
V
RD+
RD-
V
EE
EE
CC
CC
EE
EE
T
T
R
R
T
R
(AS VIEWED THROUGH TOP OF BOARD)
10
1
2
3
4
5
6
7
8
9
BOTTOM OF BOARD
V
Tx FAULT
TxDISABLE
MOD-DEF(2)
MOD-DEF(1)
MOD-DEF(0)
RATE SELECT
LOS
V
V
EE
EE
EE
T
R
R