HFCT-5942 HP [Agilent(Hewlett-Packard)], HFCT-5942 Datasheet - Page 4

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HFCT-5942

Manufacturer Part Number
HFCT-5942
Description
Single Mode Laser Small Form Factor Transceivers for ATM, SONET OC-48/SDH STM-16 Part of the Agilent METRAK family
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HFCT-5942L
Manufacturer:
AGILENT
Quantity:
20 000
Package
The overall package concept
for the device consists of the
following basic elements; two
optical subassemblies, two
electrical subassemblies and
the housing as illustrated in
the block diagram in Figure 3.
The package outline drawing
and pin out are shown in
Figures 4 and 5. The details of
this package outline and pin
out are compliant with the
multisource definition of the 2
x 10 DIP.
A metallic nose clip provides
connection to chassis ground
for both EMI and thermal
dissipation.
DATA OUT
DATA IN
DATA IN
Tx DISABLE
B
B
P
P
4
PHOTO DETECTOR
DATA OUT
SIGNAL
Figure 3. Block Diagram
MON
MON
MON
MON
BIAS
DETECT
(+)
(-)
(+)
(-)
* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
AND CONTROL
LASER DRIVER
T
X
CIRCUIT
GROUND
QUANTIZER IC
The electrical subassemblies
consist of high volume
multilayer printed circuit
boards on which the IC and
various surface-mounted
passive circuit elements are
attached.
The receiver electrical
subassembly includes an
internal shield for the
electrical and optical
subassembly to ensure high
immunity to external EMI
fields.
The optical subassemblies are
each attached to their
respective transmit or receive
electrical subassemblies. These
two units are then fitted
within the outer housing of the
transceiver that is molded of
filled nonconductive plastic to
provide mechanical strength.
R
T
X
X
SUPPLY
SUPPLY
R
OUTPUT POWER
X
MONITORING
MONITORING
LASER DIODE
LASER BIAS
GROUND
CASE
The housing is then encased
with a metal EMI protective
shield. The case is signal
ground and we recommend
soldering the four ground tabs
to host card signal ground.
The pcb’s for the two electrical
subassemblies both carry the
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into
the molding of the device and
are designed to provide the
mechanical strength required
to withstand the loads
imposed on the transceiver by
mating with the LC
connectored fiber cables.
Although they are not
connected electrically to the
transceiver, it is recommended
to connect them to chassis
ground.
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
*
LC
RECEPTACLE

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