UPD6461GS NEC [NEC], UPD6461GS Datasheet - Page 57

• Manufacturer Part Number: UPD6461GS
• Description: CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS
• Manufacturer: NEC [NEC]

9. RECOMMENDED SOLDERING CONDITIONS
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
(C10535E).
Surface Mount Devices
PD6461GS-xxx: 20-pin plastic shrink SOP (300 mil)
PD6461GT-xxx: 24-pin plastic SOP (375 mil)
PD6462GS-xxx: 20-pin plastic shrink SOP (300 mil)
Infrared ray reflow
Vapor phase soldering
Wave soldering
Partial heating method
When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
Process
device will be damaged by heat stress.
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 2 times.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
Conditions
PD6461, 6462
WS60-00-1
VP15-00-2
IR35-00-2
Symbol
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