HX640 LATTICE [Lattice Semiconductor], HX640 Datasheet - Page 2

• Manufacturer Part Number: HX640
• Manufacturer: LATTICE [Lattice Semiconductor]

iCE40 HX-Series Ultra-Low Power mobileFPGA
Ordering Information
Lattice Semiconductor Corporation
www.latticesemi.com/
Figure 2
when ordering die-based products. See the separate iCE40 Pinout Excel files for package and pinout specifications.
640, 1K, 4K, 8K
describes the iCE40HX ordering codes for all packaged components. See the separate DiePlus data sheets
High Performance
Logic Cells
Figure 2:
Series
iCE40HX 8K - CM 225
iCE40HX Ordering Codes (packaged, non-die components)
225-ball Chip-Scale BGA Package
(7x7 mm footprint, 0.4 mm pitch)
iCE40HX8K-CM225
CM
CB
C
VQ = Very Thin Quad flat pack (0.5 mm pitch)
TQ = Thin Quad flat pack (0.5 mm pitch)
QN
T
= chip-scale ball grid (0.8 mm pitch)
™
= chip-scale ball grid (0.4 mm pitch)
= chip-scale ball grid (0.5 mm pitch)
= quad flat no-lead (0.5 mm pitch)
Family
Package Leads
Package Style
(1.31, 30-MAR-2012)
2