SI8600AC-B-ISR Silicon Laboratories, SI8600AC-B-ISR Datasheet
SI8600AC-B-ISR
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SI8600AC-B-ISR Summary of contents
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... Intelligent Power systems Isolated SMPS systems with PMBus interfaces 2 C and SMBus serial VDE certification conformity IEC 60747-5-2 (VDE0884 Part 2) EN60950-1 (reinforced insulation) Copyright © 2012 by Silicon Laboratories Si860x U NIDIRECTIONAL 2 C Ordering Information: See page 26. Si860x ...
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Si860x 2 Rev. 1.1 ...
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T C ABLE O F ONTENTS Section 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Si860x 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter Ambient Operating Temperature* Supply Voltage *Note: The maximum ambient temperature is dependent on data frequency, output loading, number of operating channels, and supply voltage. Table 2. Si860x Power Characteristics* 3.0 ...
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Table 2. Si860x Power Characteristics* (Continued) 3.0 V < VDD < 5 –40 to +125 °C. Typical specs at 25 °C (See Figures 2 and 9 for test diagrams.) Parameter Symbol Si8606 Supply Current AVDD Current Idda ...
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Si860x Table 3. Si8600/02/05/06 Electrical Characteristics for Bidirectional I 3.0 V < VDD < 5 –40 to +125 °C. Typical specs at 25 °C unless otherwise noted. Parameter Timing Specifications (Measured at 1.40 V Unless Otherwise Specified) ...
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Table 4. Electrical Characteristics for Unidirectional Non-I 3.0 V < VDD < 5 –40 to +125 °C. Typical specs at 25 °C Parameter Symbol Positive-Going Input Threshold Negative-Going Input Threshold Input Hysteresis High Level Input Voltage Low ...
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Si860x Table 5. Electrical Characteristics for All I 3.0 V < VDD < 5 –40 to +125 °C. Typical specs at 25 °C Parameter VDD Undervoltage Threshold VDD Undervoltage Threshold VDD Negative-Going Lockout Hysteresis Common Mode Transient ...
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Test Circuits Figure 2 depicts the timing test diagram Figure 2. Simplified Timing Test Diagram Table 6. Regulatory Information* CSA The Si860x is certified under CSA Component Acceptance Notice 5A. For ...
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Si860x Table 7. Insulation and Safety-Related Specifications Parameter Symbol 1 L(1O1) Nominal Air Gap (Clearance) Nominal External Tracking L(1O2) 1 (Creepage) Minimum Internal Gap (Internal Clearance) Tracking Resistance (Proof Tracking Index) Erosion Depth 2 Resistance (Input-Output) 2 Capacitance (Input-Output) 3 ...
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Table 9. IEC 60747-5-2 Insulation Characteristics for Si86xxxx* Symbol Parameter Maximum Working Insulation V Voltage Input to Output Test Voltage V Transient Overvoltage Pollution Degree (DIN VDE 0110, Table 1) Insulation Resistance 500 V ...
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Si860x Table 11. Thermal Characteristics Parameter IC Junction-to-Air Thermal Resistance 400 300 270 200 160 100 0 0 Figure 3. NB SOIC-8 Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per DIN EN 60747-5-2 500 400 350 ...
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Figure 5. WB SOIC-16 Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per DIN EN 60747-5-2 Table 12. Absolute Maximum Ratings Parameter 2 Storage Temperature Ambient Temperature Under ...
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Si860x 2. Functional Description 2.1. Theory of Operation The operation of an Si86xx channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path ...
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Typical Application Overview 2 3. Background 2 In many applications SMBus, and PMBus interfaces require galvanic isolation for safety or ground loop elimination. For example, Power over Ethernet (PoE) applications typically use an I between ...
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Si860x 2 3. Isolator Design Constraints 2 Table 13 lists the I C isolator design constraints. Design Constraint To prevent the latch condition, the isolator output low level must be greater than the isolator input low level. The ...
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Typical Application Schematics Figures 9 through 14 illustrate typical circuit configurations using the Si8600, Si8602, Si8605, and Si8606. AVDD 0.1 µ ASDA ASCL AGND Figure 9. Typical Si8600 Application Diagram AVDD 0.1 µF 3k ASDA ASCL AGND ...
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Si860x AGND AVDD 0.1 µF 3k ASDA ASCL AGND Figure 12. Typical Si8602 Application Diagram AVDD 0.1 µ ASDA RESET Micro- controller ASCL AGND Figure 13. Typical Si8605 Application Diagram AVDD 0.1 µ ASDA RESET INT ...
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Device Operation Device behavior during start-up, normal operation, and shutdown is shown in Figure 15, where UVLO+ and UVLO- are the positive-going and negative-going thresholds respectively. Refer to Table 14 to determine outputs when power supply (VDD) is not ...
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Si860x 4.3. Input and Output Characteristics for Non-I The unidirectional Si86xx inputs and outputs are standard CMOS drivers/receivers. The nominal output impedance of an isolator driver channel is approximately 50 , ±40%, which is a combination of the value of ...
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Layout Recommendations To ensure safety in the end user application, high voltage circuits (i.e., circuits with >30 V separated from the safety extra-low voltage circuits (SELV is a circuit with <30 V (creepage/clearance component, such as a ...
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Si860x 4.6. Typical Performance Characteristics The typical performance characteristics depicted in the following diagrams are for information purposes only. Refer to Tables and 5 for actual specification limits. Side A Side B 2 Figure 16 ...
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Pin Descriptions 1 AVDD Bidirectional ASDA 2 Isolator Channel Bidirectional ASCL 3 Isolator Channel AGND 4 Si8600 Table 15. Si8600/02 in SOIC-8 Package Pin Name 1 AVDD Side A power supply terminal; connect to a source of 3.0 to ...
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Si860x AGND AVDD ASDA 5 ASCL 6 7 AGND NC 8 Table 16. Si8600/02 in Narrow and Wide-Body SOIC-16 Packages Pin Name 1 AGND Side A Ground Terminal connection. 3 AVDD ...
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AVDD Bidirectional ASDA 3 Isolator Channel Unidirectional 4 ADIN Isolator Channel Unidirectional ADOUT 5 Isolator Channel ASCL Bidirectional 6 Isolator Channel NC 7 AGND 8 Si8605 Table 17. Si8605/06 in Narrow and Wide-Body SOIC-16 Packages Pin Name ...
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... Si8600AC-B-IS 2 Si8600AD-B-IS 2 Si8602AC-B-IS 1 Si8602AD-B-IS 1 Si8605AC-B-IS1 2 Si8605AD-B-IS 2 Si8606AC-B-IS1 2 Si8606AD-B-IS 2 2,3 Revision A Devices Si8600AC-A-IS 2 Si8600AD-A-IS 2 Si8602AC-A-IS 1 Si8602AD-A-IS 1 Si8605AC-A-IS1 2 Si8605AD-A-IS 2 Si8606AC-A-IS1 2 Si8606AD-A-IS 2 Notes: 1. All packages are RoHS-compliant with peak reflow temperature of 260 °C according to the JEDEC industry standard classifications and peak solder temperature. ...
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Package Outline: 16-Pin Wide Body SOIC Figure 21 illustrates the package details for the Si860x Digital Isolator. Table 19 lists the values for the dimensions shown in the illustration. Table 19. Package Diagram Dimensions Figure 21. 16-Pin Wide Body ...
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Si860x 8. Land Pattern: 16-Pin Wide-Body SOIC Figure 22 illustrates the recommended land pattern details for the Si860x in a 16-pin wide-body SOIC. Table 20 lists the values for the dimensions shown in the illustration. Table 20. 16-Pin Wide Body ...
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Package Outline: 8-Pin Narrow Body SOIC Figure 23 illustrates the package details for the Si860x in an 8-pin SOIC (SO-8). Table 21 lists the values for the dimensions shown in the illustration. Figure 23. 8-pin Small Outline Integrated Circuit ...
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Si860x 10. Land Pattern: 8-Pin Narrow Body SOIC Figure 24 illustrates the recommended land pattern details for the Si860x in an 8-pin narrow-body SOIC. Table 22 lists the values for the dimensions shown in the illustration. Figure 24. PCB Land ...
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Package Outline: 16-Pin Narrow Body SOIC Figure 25 illustrates the package details for the Si860x in a 16-pin narrow-body SOIC (SO-16). Table 23 lists the values for the dimensions shown in the illustration. Figure 25. 16-pin Small Outline Integrated ...
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Si860x Table 23. Package Diagram Dimensions (Continued) Dimension h θ aaa bbb ccc ddd Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC ...
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Land Pattern: 16-Pin Narrow Body SOIC Figure 26 illustrates the recommended land pattern details for the Si860x in a 16-pin narrow-body SOIC. Table 24 lists the values for the dimensions shown in the illustration. Figure 26. 16-Pin Narrow Body ...
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Si860x 13. Top Markings 13.1. Si860x Top Marking (16-Pin Wide Body SOIC) 13.2. Top Marking Explanation (16-Pin Wide Body SOIC) Line 1 Marking: Base Part Number Ordering Options (See Ordering Guide for more information). Line 2 Marking Year ...
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Si860x Top Marking (8-Pin Narrow Body SOIC) 13.4. Top Marking Explanation (8-Pin Narrow Body SOIC) Line 1 Marking: Base Part Number Ordering Options (See Ordering Guide for more information Year Line 2 Marking Work week ...
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Si860x 13.5. Si860x Top Marking (16-Pin Narrow Body SOIC) 13.6. Top Marking Explanation (16-Pin Narrow Body SOIC) Base Part Number Line 1 Marking: Ordering Options Line 2 Marking: Circle = 1.2 mm Diameter YY = Year WW = Work Week ...
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OCUMENT HANGE IST Revision 0.1 to Revision 0.2 Si8601 replaced by Si8602 throughout. Added chip graphics on page 1. Moved Table 12 to page 13. Updated Table 3, “Si8600/02/05/06 Electrical Characteristics for Bidirectional ...
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