GTL1655DGG,518 NXP Semiconductors, GTL1655DGG,518 Datasheet - Page 21

• Manufacturer Part Number: GTL1655DGG,518
• Description: IC TXRX BUS 16BIT 3-3.6V TSSOP64
• Manufacturer: NXP Semiconductors

Specifications of GTL1655DGG,518

• Logic Function: *
• Number Of Bits: 16
• Input Type: *
• Output Type: *
• Data Rate: *
• Number Of Channels: *
• Number Of Outputs/channel: *
• Differential - Input:output: *
• Propagation Delay (max): *
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TSSOP
• Mounting Type: Surface Mount
• Supply Voltage: 3 V ~ 3.6 V
• Logic Type: LVTTL-TO-GTL/GTL+ TRANSCEIVER
• Logic Family: GTL
• Operating Supply Voltage (typ): 3.3V
• Propagation Delay Time: 7.2ns
• Number Of Elements: 1
• Input Logic Level: LVTTL/TTL
• Output Logic Level: GTL
• Package Type: TSSOP
• Polarity: Non-Inverting
• Logical Function: Universal Bus Transceiver
• Operating Supply Voltage (min): 3V
• Technology: BiCMOS
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Operating Supply Voltage (max): 3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935270638518; GTL1655DGG-T; GTL1655DGG-T

Philips Semiconductors
14. Revision history
Table 19:
9397 750 12936
Product data
Rev Date
01
20040511
Revision history
CPCN
-
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Description
Product data (9397 750 12936).
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 01 — 11 May 2004
16-bit LVTTL-to-GTL/GTL+ bus transceiver with live insertion
10 C measured in the atmosphere of the reflow
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
GTL1655
21 of 23