74AVC8T245PW NXP Semiconductors, 74AVC8T245PW Datasheet - Page 19
74AVC8T245PW
Manufacturer Part Number
74AVC8T245PW
Description
Bus Transceivers Bus XCVR Single 8-CH 3-ST
Manufacturer
NXP Semiconductors
Datasheet
1.74AVC8T245PW.pdf
(24 pages)
Specifications of 74AVC8T245PW
Rohs
yes
Factory Pack Quantity
63
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74AVC8T245PW
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
13. Package outline
Fig 12. Package outline SOT355-1 (TSSOP24)
74AVC8T245
Product data sheet
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT355-1
max.
1.1
A
24
1
0.15
0.05
A
Z
1
y
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
0.2
0.1
c
REFERENCES
Rev. 5 — 27 December 2012
D
b
7.9
7.7
0
(1)
p
13
12
E
4.5
4.3
w
(2)
M
JEITA
scale
2.5
0.65
e
c
8-bit dual supply translating transceiver; 3-state
H
6.6
6.2
E
A
2
5 mm
A
L
1
1
0.75
0.50
L
p
H
E
E
detail X
0.4
0.3
Q
PROJECTION
L
EUROPEAN
0.2
L
v
p
74AVC8T245
Q
0.13
w
A
(A )
3
0.1
X
© NXP B.V. 2012. All rights reserved.
y
θ
v
A
ISSUE DATE
M
99-12-27
03-02-19
A
Z
0.5
0.2
(1)
SOT355-1
8
0
θ
o
o
19 of 24