74AVC8T245PW NXP Semiconductors, 74AVC8T245PW Datasheet - Page 3

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74AVC8T245PW

Manufacturer Part Number
74AVC8T245PW
Description
Bus Transceivers Bus XCVR Single 8-CH 3-ST
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74AVC8T245PW

Rohs
yes
Factory Pack Quantity
63

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74AVC8T245PW
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
74AVC8T245PW
Quantity:
1 754
NXP Semiconductors
5. Pinning information
74AVC8T245
Product data sheet
Fig 2.
Fig 3.
Logic diagram (one channel)
Pin configuration TSSOP24
V
CC(A)
GND
GND
DIR
A1
A2
A3
A4
A5
A6
A7
A8
10
11
12
1
2
3
4
5
6
7
8
9
5.1 Pinning
74AVC8T245
001aai489
DIR
A1
All information provided in this document is subject to legal disclaimers.
24
23
22
21
20
19
18
17
16
15
14
13
V
V
OE
B1
B2
B3
B4
B5
B6
B7
B8
GND
CC(B)
CC(B)
V
CC(A)
Rev. 5 — 27 December 2012
to other seven channels
Fig 4.
8-bit dual supply translating transceiver; 3-state
(1) This is not a supply pin. The substrate is attached to this
V
CC(B)
index area
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Pin configuration DHVQFN24
terminal 1
001aai473
GND
DIR
A1
A2
A3
A4
A5
A6
A7
A8
OE
B1
10
11
2
3
4
5
6
7
8
9
Transparent top view
74AVC8T245
GND
74AVC8T245
(1)
© NXP B.V. 2012. All rights reserved.
23
22
21
20
19
18
17
16
15
14
001aai490
V
OE
B1
B2
B3
B4
B5
B6
B7
B8
CC(B)
3 of 24

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