M24512-DRMN6TP STMicroelectronics, M24512-DRMN6TP Datasheet - Page 5

• Manufacturer Part Number: M24512-DRMN6TP
• Description: EEPROM 512 Kbit serial I2C EEPROM 3 Chip
• Manufacturer: STMicroelectronics

Specifications of M24512-DRMN6TP

• Product Category: EEPROM
• Rohs: yes

M24512-W M24512-R M24512-DR M24512-DF
List of figures
Figure 1.
Figure 2.
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Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
WLCSP connections for the M24512-DFCS6TP/K
(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Maximum R
an I
Maximum R
an I
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 33
SO8N – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 34
UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package outline . . . . . . . 35
M24512-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline . . . . . . . . 36
2
C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
2
C bus at maximum frequency f
C bus at maximum frequency f
bus
bus
value versus bus parasitic capacitance (C
value versus bus parasitic capacitance C
Doc ID 16459 Rev 26
C
C
= 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
= 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
bus
bus
) for
) for
List of figures
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