FT313HP-R FTDI, FT313HP-R Datasheet - Page 60

• Manufacturer Part Number: FT313HP-R
• Description: USB Interface IC USB High Speed USB-- Host Controller IC--
• Manufacturer: FTDI

Specifications of FT313HP-R

• Rohs: yes
• Product: USB 2.0
• Data Rate: 480 Mbps
• Interface Type: USB
• Operating Supply Voltage: 1.62 V to 3.63 V
• Operating Supply Current: 35 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TQFP-64
• Minimum Operating Temperature: - 40 C

8.4 Solder Reflow Profile
The FT313H is supplied in Pb free QFN-64, LQFP-64 and TQFP-64 packages. The recommended solder
reflow profile for all package options is shown in Figure 8-4.
Figure 8-4 FT313H Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 8-1. Values are shown for
both a completely Pb free solder process (i.e. the FT313H is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT313H is used with non-Pb free solder).
Table 8-1 Reflow Profile Parameter Values
25
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
Copyright © 2012 Future Technology Devices International Limited
Preheat
T = 25º C to T
Time, t (seconds)
Min to t
(t
T
L
p
t
:
S
)
L
)
s
Max)
s
s
P
L
)
Min.)
Max.)
s
p
Ramp Up
)
to T
p
)
p
FT313H USB2.0 HS Host Controller Datasheet Version 1.1
Pb Free Solder Process
t
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
p
20 to 40 seconds
8 minutes Max.
t
L
150°C
200°C
217°C
260°C
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
p
Non-Pb Free Solder Process
Document No.: FT_000589
Clearance No.: FTDI# 318
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
183°C
240°C
60