TJA1028TK/5V0/20,1 NXP Semiconductors, TJA1028TK/5V0/20,1 Datasheet - Page 10

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TJA1028TK/5V0/20,1

Manufacturer Part Number
TJA1028TK/5V0/20,1
Description
LIN Transceivers LIN XCVR INTEGRATED VOLT REG
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TJA1028TK/5V0/20,1

Rohs
yes
Factory Pack Quantity
6000

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TJA1028TK/5V0/20,115
Manufacturer:
TE
Quantity:
20 000
NXP Semiconductors
[3]
[4]
[5]
[6]
[7]
9. Thermal characteristics
Table 5.
[1]
[2]
[3]
10. Static characteristics
Table 6.
V
currents flow into the IC; typical values are given at V
TJA1028
Product data sheet
Symbol
R
Symbol
Supply; pin V
I
V
V
V
Supply; pin V
V
I
BAT
Olim
BAT
th(det)pon
th(det)poff
hys(det)pon
CC
th(j-a)
ESD performance of pins LIN and V
Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ).
Charged Device Model (CDM): according to AEC-Q100-011 (field induced charge; 4 pF).
Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
Junction temperature in accordance with IEC 60747-1. An alternative definition is: T
The rating for T
According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers
(thickness: 35 m) and thermal via array under the package connected to the first inner copper layer.
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers
(thickness: 35 m) and thermal via array under the exposed pad connected to the first inner copper layer.
= 5.5 V to 28 V; T
Thermal characteristics
Static characteristics
Parameter
thermal resistance from junction to ambient
BAT
CC
Parameter
battery supply current
power-on detection threshold
voltage
power-off detection threshold
voltage
power-on detection hysteresis
voltage
supply voltage
output current limit
vj
limits the allowable combinations of power dissipation (P) and ambient temperature (T
vj
=
40
C to +150
BAT
according to IEC 61000-4-2 (150 pF, 330 ) has been verified by an external test house.
All information provided in this document is subject to legal disclaimers.
C; R
Conditions
Standby mode; V
Sleep mode; V
Normal mode; bus recessive;
V
Normal mode; bus dominant;
V
V
V
V
I
V
VCC
L(LIN-VBAT)
LIN
BAT
BAT
CC(nom)
CC(nom)
CC
= 0 V to 5.5 V
= V
= 70 mA to 0 mA
Rev. 4 — 25 July 2012
= 12 V; V
= 2 V to 28 V
BAT
BAT
= 5 V; I
= 3.3 V; V
= 12 V; unless otherwise specified.
= 500
; V
RXD
TXD
LIN
VCC
LIN
= V
= V
= 0 V; V
; all voltages are defined with respect to ground; positive
BAT
Conditions
SO8; four-layer board
HVSON8; single-layer board
HVSON8; four-layer board
LIN transceiver with integrated voltage regulator
SO8; single-layer board
= 70 mA to 0 mA
= V
BAT
CC
= 4.5 V to 28 V;
BAT
; V
RSTN
RSTN
j
= HIGH
= HIGH
= T
amb
+ P  R
Min
-
-
-
-
-
3
50
3.234
250
4.9
th(j-a)
amb
, where R
).
3.3
Typ
45
12
850
2.0
-
-
-
5
-
[1]
[2]
[1]
[3]
TJA1028
© NXP B.V. 2012. All rights reserved.
th(j-a)
Typ
132
93
129
67
Max
59
18
1800
4.5
5.25
4.2
-
5.1
3.366
70
is a fixed value.
Unit
K/W
K/W
K/W
K/W
10 of 24
V
Unit
A
A
A
mA
V
V
mV
V
mA

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