M27C64A-20F1 STMicroelectronics, M27C64A-20F1 Datasheet - Page 5

• Manufacturer Part Number: M27C64A-20F1
• Description: IC EPROM 64KBIT 200NS 28CDIP
• Manufacturer: STMicroelectronics

Specifications of M27C64A-20F1

• Format - Memory: EPROMs
• Memory Type: UV EPROM
• Memory Size: 64K (8K x 8)
• Speed: 200ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-CDIP (0.600", 15.24mm) Window
• Capacitance, Input: 6 pF
• Capacitance, Output: 12 pF
• Current, Input, Leakage: ±10 μA (Read)
• Current, Operating: 30 mA (Read)
• Current, Output, Leakage: ±10 μA (Read)
• Current, Supply: 30 mA (Max.)
• Density: 64K
• Organization: 8K×8
• Package Type: FDIP28W
• Temperature, Operating: 0 to +70 °C
• Temperature, Operating, Maximum: 85 °C
• Temperature, Operating, Minimum: -40 °C
• Time, Access: 200 ns
• Time, Fall: ≤20 ns
• Time, Rise: ≤20 ns
• Voltage, Input, High: 6 V (Read)
• Voltage, Input, High Level: 2 V (Min.)
• Voltage, Input, Low: 0.8 V (Read)
• Voltage, Input, Low Level: -0.3 V (Max.)
• Voltage, Output, High: 4.3 V (Read)
• Voltage, Output, Low: 0.4 V (Read)
• Voltage, Programmable: 11.5 V (Min.)
• Voltage, Supply: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-1686-5

M27C64A
1
Summary description
The M27C64A is a 64Kbit EPROM offered in the two ranges UV (ultra violet erase) and OTP
(one time programmable). It is ideally suited for microprocessor systems requiring large
programs and is organized as 8,192 by 8 bits.
The FDIP28W (window ceramic frit-seal package) has transparent lid which allows the user
to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only on time and erasure is not required,
the M27C64A is offered in PLCC32 package.
In order to meet environmental requirements, ST offers the M27C64A in ECOPACK
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Summary description
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