CY7C1361B-100AC Cypress Semiconductor Corp, CY7C1361B-100AC Datasheet

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CY7C1361B-100AC

Manufacturer Part Number
CY7C1361B-100AC
Description
IC SRAM 9MBIT 100MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1361B-100AC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
9M (256K x 36)
Speed
100MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
428-1504

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1361B-100AC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1361B-100AC
Manufacturer:
CYPRESS
Quantity:
60
Cypress Semiconductor Corporation
Document #: 38-05302 Rev. *B
Features
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Notes:
• Supports 133-MHz bus operations
• 256K X 36/512K X 18 common I/O
• 3.3V –5% and +10% core power supply (V
• 2.5V or 3.3V I/O supply (V
• Fast clock-to-output times
• Provide high-performance 2-1-1-1 access rate
• User-selectable burst counter supporting Intel
• Separate processor and controller address strobes
• Synchronous self-timed write
• Asynchronous output enable
• Offered in JEDEC-standard 100-pin TQFP, 119-ball BGA
• JTAG boundary scan for BGA and fBGA packages
• “ZZ” Sleep Mode option
1. For best–practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
2. CE
Pentium
and 165-ball fBGA packages
— Both 2 and 3 Chip Enable Options for TQFP
— 6.5 ns (133-MHz version)
— 7.5 ns (117-MHz version)
— 8.5 ns (100-MHz version)
3
is for A version of TQFP (3 Chip Enable Option) and 165 fBGA package only. 119 BGA is offered only in 2 Chip Enable.
interleaved or linear burst sequences
DDQ
)
DD
3901 North First Street
)
133 MHz
250
6.5
30
Functional Description
The CY7C1361B/CY7C1363B is a 3.3V, 256K x 36 and 512K
x 18 Synchronous Flow through SRAMs, respectively
designed to interface with high-speed microprocessors with
minimum glue logic. Maximum access delay from clock rise is
6.5 ns (133-MHz version). A 2-bit on-chip counter captures the
first address in a burst and increments the address automati-
cally for the rest of the burst access. All synchronous inputs
are gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
( CE
Control inputs ( ADSC , ADSP , and ADV ), Write Enables ( BW
and BWE ), and Global Write ( GW ). Asynchronous inputs
include the Output Enable ( OE ) and the ZZ pin .
The CY7C1361B/CY7C1363B allows either interleaved or
linear burst sequences, selected by the MODE input pin. A
HIGH selects an interleaved burst sequence, while a LOW
selects a linear burst sequence. Burst accesses can be
initiated with the Processor Address Strobe (ADSP) or the
cache Controller Address Strobe (ADSC) inputs. Address
advancement is controlled by the Address Advancement
(ADV) input.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor ( ADSP ) or
Address Strobe Controller ( ADSC ) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin ( ADV ).
The CY7C1361B/CY7C1363B operates from a +3.3V core
power supply while all outputs may operate with either a +2.5
or +3.3V supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
9-Mbit (256K x 36/512K x 18)
1
), depth-expansion Chip Enables (CE
117 MHz
220
7.5
30
San Jose
Flow-Through SRAM
,
CA 95134
[1]
100 MHz
180
8.5
30
Revised April 20, 2004
CY7C1361B
CY7C1363B
2
and CE
408-943-2600
3
Unit
mA
mA
[2]
ns
), Burst
x
,

Related parts for CY7C1361B-100AC

CY7C1361B-100AC Summary of contents

Page 1

... Cypress Semiconductor Corporation Document #: 38-05302 Rev. *B 9-Mbit (256K x 36/512K x 18) Functional Description The CY7C1361B/CY7C1363B is a 3.3V, 256K x 36 and 512K x 18 Synchronous Flow through SRAMs, respectively designed to interface with high-speed microprocessors with ) DD minimum glue logic. Maximum access delay from clock rise is 6 ...

Page 2

... Logic Block Diagram – CY7C1361B (256K x 36) A0, A1, A MODE ADV CLK ADSC ADSP DQP BYTE BYTE WRITE REGISTER WRITE REGISTER DQ DQP , BYTE WRITE REGISTER DQ DQP , BYTE WRITE REGISTER DQ DQP , BYTE BWE WRITE REGISTER GW ENABLE CE1 REGISTER CE2 CE3 OE SLEEP ZZ CONTROL 2 Logic Block Diagram – CY7C1363B (512K x 18) ...

Page 3

... Document #: 38-05302 Rev DQP DDQ 4 DDQ SSQ 5 SSQ SSQ 10 SSQ DDQ 11 DDQ /DNU DDQ 20 DDQ SSQ 21 SSQ DQP SSQ 26 SSQ DDQ 27 DDQ DQP CY7C1361B CY7C1363B DDQ 76 V SSQ NC 75 DQP SSQ V 70 DDQ CY7C1363B (512K x 18 DDQ 60 V SSQ SSQ V 54 DDQ Page ...

Page 4

... TQFP (2 Chip Enables) (AJ Version) DQP DDQ 4 DDQ SSQ 5 SSQ SSQ 10 SSQ DDQ 11 DDQ /DNU DDQ 20 DDQ SSQ 21 SSQ DQP SSQ 26 SSQ DDQ 27 DDQ DQP CY7C1361B CY7C1363B DDQ V 76 SSQ NC 75 DQP SSQ V 70 DDQ CY7C1363B (512K x 18 DDQ V 60 SSQ SSQ V 54 DDQ Page ...

Page 5

... Pin Configurations (continued DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ Document #: 38-05302 Rev. *B 119-ball BGA (2 Chip Enables with JTAG) CY7C1361B (256K x 36 ADSP CE A ADSC DQP ADV CLK BWE DQP MODE TMS TDI TCK CY7C1363B (512K x 18 ADSP ...

Page 6

... DDQ N DQP DDQ 72M A R MODE NC / 36M 288M DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ N DQP DDQ 72M A R MODE NC / 36M A Document #: 38-05302 Rev. *B 165-ball fBGA (3 Chip Enable) CY7C1361B (256K x 36 CLK 18M SS TDI TMS CY7C1363B (512K x 18 CLK ...

Page 7

... CY7C1361B–Pin Definitions TQFP TQFP (3-Chip (2-Chip Name Enable) Enable 37,36,32,33, 37,36,32,33 34,35,43,44, 34,35,44,45, 45,46,47,48, 46,47,48,49, 49,50,81,82, 50,81,82,92, 99,100 99,100 93,94,95,96 93,94,95,96 L5,G5,G3 CLK – [ ADV 84 84 ADSP Document #: 38-05302 Rev. *B BGA fBGA (2-Chip (3-Chip Enable) Enable) I/O P4,N4,A2, R6,P6,A2, Input- ...

Page 8

... CY7C1361B–Pin Definitions TQFP TQFP (3-Chip (2-Chip Name Enable) Enable ADSC 87 87 BWE 52,53,56,57, 52,53,56,57 58,59,62,63, 58,59,62,63, 68,69,72,73, 68,69,72,73, 74,75,78,79, 74,75,78,79, 2,3,6,7,8,9, 2,3,6,7,8,9, 12,13,18,19, 12,13,18,19, 22,23,24,25, 22,23,24,25, 28,29 28,29 51,80,1,30 51,80,1,30 P6,D6,D2, DQP [A:D] MODE 15,41,65,91 15,41,65,91 J2,C4,J4 4,11,20,27, 4,11,20,27, DDQ ...

Page 9

... CY7C1361B–Pin Definitions TQFP TQFP (3-Chip (2-Chip Name Enable) Enable) V 17,40,67,90 17,40,67,90 H2,D3,E3 5,10,21,26, 5,10,21,26, SSQ 55,60,71,76 55,60,71,76 TDO – – TDI – – TMS – – TCK – – NC 16,38,39,42, 16,38,39,42, 66 43,66 V /DNU CY7C1363B: Pin Definitions TQFP TQFP (3-Chip (2-Chip ...

Page 10

... Asynchronous G4 A9 Input- Synchronous A4 B9 Input- Synchronous CY7C1361B CY7C1363B Description Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Sampled on the rising edge of CLK. Global Write Enable Input, active LOW. When asserted LOW on the rising edge of ...

Page 11

... D9,E3,E9, Supply M1,M7,U1 F3,F9,G3, ,U7 G9,J3,J9, K3,K9,L3, L9,M3,M9, N3,N9 CY7C1361B CY7C1363B Description Address Strobe from Controller, sampled on the rising edge of CLK, active LOW. When asserted LOW, addresses presented to the device are captured in the address registers. A [1:0] also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized ...

Page 12

... R1,R5,R7, N2,N5,N6, T1,T4,U6 N7,N10,N11, P1,P2,R2 – – Ground/DNU CY7C1361B CY7C1363B Description Ground for the core of the device. Ground for the I/O circuitry. Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG feature is not being utilized, this pin should be left unconnected. This pin is not available on TQFP packages ...

Page 13

... Maximum access delay from the clock rise ( 6.5 ns (133-MHz device). C0 The CY7C1361B/CY7C1363B supports secondary cache in systems utilizing either a linear or interleaved burst sequence. The interleaved burst order supports Pentium processors. The linear burst sequence is suited for processors that utilize a linear burst sequence ...

Page 14

... CY7C1361B CY7C1363B Min. Max. Unit CYC 2t ns CYC 2t ns CYC 0 ns ADV WRITE OE CLK L-H three-state L-H three-state L-H three-state L-H three-state L-H three-state three-state L L-H three-state L L L-H three-state L L-H three-state L L-H three-state L-H three-state L L-H three-state L L Writes may occur only on subsequent clocks after ...

Page 15

... Partial Truth Table for Read/Write Function (CY7C1361B) Read Read Write Byte (A, DQP ) A Write Byte (B, DQP ) B Write Bytes (B, A, DQP , DQP ) A B Write Byte (C, DQP ) C Write Bytes (C, A, DQP , DQP ) C A Write Bytes (C, B, DQP , DQP ) C B Write Bytes ( DQP , DQP , DQP ...

Page 16

... IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1361B/CY7C1363B incorporates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM ...

Page 17

... TAP controller’s capture setup plus t t hold time ( CS plus CH). The SRAM clock input might not be captured correctly if there portion way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue still CY7C1361B CY7C1363B Unlike the SAMPLE/PRELOAD Page ...

Page 18

... Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions CYC TL t TMSS t TMSH t TDIS t TDIH DON’T CARE [9, 10] Over the operating Range Description /t = 1ns R F CY7C1361B CY7C1363B TDOV t TDOX UNDEFINED Min. Max Page ...

Page 19

... OL DDQ 2.5V OL DDQ I = 100 µ 3.3V DDQ 2.5V DDQ V = 3.3V DDQ V = 2.5V DDQ V = 3.3V DDQ V = 2.5V DDQ GND < V < DDQ CY7C1361B CY7C1363B ......................................... V to 2.5V SS 1.25V 20pF O MIN MAX UNIT 2.4 V 2.0 V 2.9 V 2.1 V 0.4 V 0.4 V 0.2 V 0 ...

Page 20

... Do Not Use: This instruction is reserved for future use. Do Not Use: This instruction is reserved for future use. Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. CY7C1361B CY7C1363B Description Describes the version number. Reserved for Internal Use ...

Page 21

... BGA Boundary Scan Order CY7C1361B (256K x 36) BALL Signal BIT# ID Name BIT# BALL ID 1 CLK BWE ADSC ADSP ADV DQP DQP Document #: 38-05302 Rev. *B Signal Name BIT# BALL MODE 7 P2 DQP Internal Internal Internal Internal Internal Internal Internal C D2 DQP ...

Page 22

... Boundary Scan Order CY7C1361B (256K x 36) BALL Signal BIT# ID Name BIT CLK BWE ADSC ADSP ADV 43 8 B10 A10 C11 DQP E10 F10 G10 D10 D11 E11 F11 G11 H11 J10 K10 L10 M10 J11 K11 L11 M11 DQ 63 ...

Page 23

... V – 0. inputs static /2), undershoot: V (AC) > -2V (Pulse width less than t CYC IL (min.) within 200ms. During this time V < CY7C1361B CY7C1363B Ambient Temperature V DD 0°C to +70°C 3.3V – 5%/+10% 2.5V – 5% –40°C to +85°C Min. Max. 3.135 3.6 3.135 ...

Page 24

... Test Conditions T = 25° MHz 3.3V 2.5V DDQ R = 317Ω 3.3V OUTPUT 351Ω INCLUDING JIG AND (b) SCOPE R = 1667Ω 2.5V OUTPUT =1538Ω INCLUDING JIG AND (b) SCOPE CY7C1361B CY7C1363B TQFP BGA fBGA Package Package Package TQFP BGA fBGA Package Package Package ...

Page 25

... V POWER is less than t and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ CHZ CLZ = 2.5V. DDQ CY7C1361B CY7C1363B 117 MHz 100 MHz Min. Max. Min. Max 8 ...

Page 26

... ADH ADVH ADVS ADV suspends burst t CDV t OELZ t OEHZ t DOH Q(A2 DON’T CARE is HIGH and CE is LOW. When CE is HIGH CY7C1361B CY7C1363B Deselect Cycle Q( Q(A2) Q( Burst wraps around to its initial state BURST READ UNDEFINED is HIGH LOW HIGH Page CHZ ...

Page 27

... Full width write can be initiated by either GW LOW HIGH, BWE LOW and BW Document #: 38-05302 Rev. *B ADSC extends burst WES WEH ADV suspends burst D(A2 BURST WRITE DON’T CARE UNDEFINED LOW. X CY7C1361B CY7C1363B t ADS t ADH A3 t WES t WEH t ADVS t ADVH D( D(A3 Extended BURST WRITE Page ...

Page 28

... Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device. 26. DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05302 Rev WEH WES OELZ D(A3) t OEHZ t CDV Q(A4) Single WRITE DON’T CARE CY7C1361B CY7C1363B A5 D(A5) Q(A4+1) Q(A4+2) Q(A4+3) BURST READ Back-to-Back WRITEs UNDEFINED Page D(A6) ...

Page 29

... Ordering Code 133 CY7C1361B-133AC CY7C1363B-133AC CY7C1361B-133AI CY7C1363B-133AI CY7C1361B-133AJC CY7C1363B-133AJC CY7C1361B-133AJI CY7C1363B-133AJI CY7C1361B-133BGC CY7C1363B-133BGC CY7C1361B-133BGI CY7C1363B-133BGI CY7C1361B-133BZC CY7C1363B-133BZC CY7C1361B-133BZI CY7C1363B-133BZI Document #: 38-05302 Rev ZZI I DDZZ High-Z DON’T CARE Package Name Part and Package Type A101 100-lead Thin Quad Flat Pack ( 1.4 mm) ...

Page 30

... CY7C1363B-117AC CY7C1361B-117AI CY7C1363B-117AI CY7C1361B-117AJC CY7C1363B-117AJC CY7C1361B-117AJI CY7C1363B-117AJI CY7C1361B-117BGC CY7C1363B-117BGC CY7C1361B-117BGI CY7C1363B-117BGI CY7C1361B-117BZC CY7C1363B-117BZC CY7C1361B-117BZI CY7C1363B-117BZI 100 CY7C1361B-100AC CY7C1363B-100AC CY7C1361B-100AI CY7C1363B-100AI CY7C1361B-100AJC CY7C1363B-100AJC CY7C1361B-100AJI CY7C1363B-100AJI CY7C1361B-100BGC CY7C1363B-100BGC CY7C1361B-100BGI CY7C1363B-100BGI CY7C1361B-100BZC CY7C1363B-100BGC CY7C1361B-100BZI CY7C1363B-100BGI Shaded areas contain advance information. Please contact your local sales representative for availability of these parts. ...

Page 31

... MIN. 1.00 REF. DETAIL Document #: 38-05302 Rev. *B DIMENSIONS ARE IN MILLIMETERS. 16.00±0.20 14.00±0. 0.30±0.08 0.65 TYP STAND-OFF 0.05 MIN. SEATING PLANE 0.15 MAX. A CY7C1361B CY7C1363B 1.40±0.05 12°±1° A SEE DETAIL (8X) 0.20 MAX. 1.60 MAX. 51-85050-*A Page ...

Page 32

... Package Diagrams (continued) Document #: 38-05302 Rev. *B 119-Lead PBGA ( 2.4 mm) BG119 CY7C1361B CY7C1363B 51-85115-*B Page ...

Page 33

... Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. Cypress products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. 165-Ball FBGA ( 1.2 mm) BB165A CY7C1361B CY7C1363B 51-85122-*C ...

Page 34

... Document History Page Document Title: CY7C1361B/CY7C1363B 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM Document #: 38-05302 Rev. *B REV. ECN NO. Issue Date ** 116857 06/24/02 *A 206502 See ECN *B 225181 See ECN Document #: 38-05302 Rev. *B Orig. of Change Description of Change RCS New Data Sheet NJY Removed Preliminary status ...

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