CY7C1381C-100AC Cypress Semiconductor Corp, CY7C1381C-100AC Datasheet - Page 33

• Manufacturer Part Number: CY7C1381C-100AC
• Description: IC SRAM 18MBIT 100MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1381C-100AC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 18M (512K x 36)
• Speed: 100MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Ordering Information
Package Diagrams
Document #: 38-05238 Rev. *B
© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Shaded areas contain advance information.
Please contact your local sales representative for availability of these parts.
GAUGE PLANE
Speed
(MHz)
100
R 0.08 MIN.
0.20 MAX.
0.25
0.60±0.15
1.00 REF.
CY7C1381C-100AC
CY7C1383C-100AC
CY7C1381C-100BGC
CY7C1383C-100BGC
CY7C1381C-100BZC
CY7C1383C-100BZC
CY7C1381C-100AI
CY7C1383C-100AI
CY7C1381C-100BGI
CY7C1383C-100BGI
CY7C1381C-100BZI
CY7C1383C-100BZI
0°-7°
Ordering Code
100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101
30
0° MIN.
1
0.20 MIN.
R 0.08 MIN.
31
DETAIL
100
0.20 MAX.
16.00±0.20
14.00±0.10
A
Package
BB165A
BB165A
BG119
BG119
Name
81
50
A101
A101
STAND-OFF
80
51
0.05 MIN.
0.15 MAX.
0.30±0.08
0.65
TYP.
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
SEATING PLANE
Part and Package Type
DIMENSIONS ARE IN MILLIMETERS.
(8X)
12°±1°
1.40±0.05
0.20 MAX.
1.60 MAX.
SEE DETAIL
A
CY7C1381C
CY7C1383C
51-85050-*A
Commercial
Operating
Page 33 of 36
Industrial
Range