PCA9624PW,118 NXP Semiconductors, PCA9624PW,118 Datasheet - Page 33

• Manufacturer Part Number: PCA9624PW,118
• Description: IC LED DRIVER RGBA 24-TSSOP
• Manufacturer: NXP Semiconductors
• Type: RGBA LED Driverr

Specifications of PCA9624PW,118

• Package / Case: 24-TSSOP
• Topology: Open Drain, PWM
• Number Of Outputs: 8
• Internal Driver: Yes
• Type - Primary: Backlight, LED Blinker
• Type - Secondary: RGBA
• Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Voltage - Output: 40V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Current - Output / Channel: 100mA
• Internal Switch(s): Yes
• Low Level Output Current: 20 mA
• Operating Supply Voltage: 2.3 V to 5.5 V
• Maximum Supply Current: 10 mA
• Maximum Power Dissipation: 100 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Efficiency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 03118 863 9352

NXP Semiconductors
PCA9624_2
Product data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 18.
Table 19.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
19
24.
Rev. 02 — 26 August 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
8-bit Fm+ I
Figure
350 to 2000
260
250
245
24) than a SnPb process, thus
2
C-bus 100 mA 40 V LED driver
220
220
350
> 2000
260
245
245
PCA9624
© NXP B.V. 2009. All rights reserved.
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