LTC3736EGN-2#PBF Linear Technology, LTC3736EGN-2#PBF Datasheet - Page 27

• Manufacturer Part Number: LTC3736EGN-2#PBF
• Description: IC CTRLR SW SYNC DUAL 2PH 24SSOP
• Manufacturer: Linear Technology
• Series: PolyPhase®r
• Type: Step-Down (Buck)r

Specifications of LTC3736EGN-2#PBF

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.6 ~ 9.8 V
• Current - Output: 1A
• Frequency - Switching: 550kHz ~ 750kHz
• Voltage - Input: 2.75 ~ 9.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

PACKAGE DESCRIPTION
4.50
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.05
MO-220 VARIATION (WGGD-X)—TO BE APPROVED
3.10
0.05
0.70 0.05
PACKAGE
OUTLINE
2.45 0.05
(4 SIDES)
.0075 – .0098
(0.19 – 0.25)
.254 MIN
.0165 ±.0015
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
RECOMMENDED SOLDER PAD LAYOUT
(0.406 – 1.270)
.016 – .050
0.50 BSC
0.25 0.05
(MILLIMETERS)
INCHES
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0° – 8° TYP
(0.38 ± 0.10)
.015 ± .004
.150 – .165
.045 ±.005
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
24-Lead Plastic SSOP (Narrow .150 Inch)
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.0250 BSC
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1641)
× 45°
(Reference LTC DWG # 05-08-1697)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
PIN 1
TOP MARK
(NOTE 6)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
ON THE TOP AND BOTTOM OF PACKAGE
GN Package
UF Package
4.00 0.10
(4 SIDES)
(5.817 – 6.198)
(0.203 – 0.305)
.008 – .012
.229 – .244
TYP
.0532 – .0688
(1.35 – 1.75)
24
1
0.200 REF
0.00 – 0.05
23
2 3
0.75 0.05
22
21
4
(8.560 – 8.738)
20
5 6 7
.337 – .344*
19
(0.635)
.0250
18
BSC
17
8 9 10 11 12
16
R = 0.115
BOTTOM VIEW—EXPOSED PAD
15 1413
TYP
(0.102 – 0.249)
.004 – .0098
LTC3736-2
(3.810 – 3.988)
.150 – .157**
GN24 (SSOP) 0204
23
(0.838)
.033
REF
24
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 45 CHAMFER
0.50 BSC
0.25 0.05
1
2
(UF24) QFN 0105
0.40 0.10
2.45 0.10
(4-SIDES)
27
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