TLP624-2(F) Toshiba, TLP624-2(F) Datasheet - Page 9

• Manufacturer Part Number: TLP624-2(F)
• Description: PHOTOCOUPLER DUAL TRANS OUT 8DIP
• Manufacturer: Toshiba

Specifications of TLP624-2(F)

• Number Of Channels: 2
• Input Type: DC
• Voltage - Isolation: 5000Vrms
• Current Transfer Ratio (min): 100% @ 1mA
• Current Transfer Ratio (max): 1200% @ 1mA
• Voltage - Output: 55V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 400mV
• Output Type: Transistor
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Configuration: 2
• Maximum Collector Emitter Voltage: 55 V
• Maximum Collector Emitter Saturation Voltage: 200 mV (Typ)
• Isolation Voltage: 5000 Vrms
• Current Transfer Ratio: 1200 %
• Maximum Forward Diode Voltage: 1.3 V
• Minimum Forward Diode Voltage: 1 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 75 C
• Minimum Operating Temperature: - 25 C
• Maximum Input Diode Current: 50 mA
• Maximum Reverse Diode Voltage: 5 V
• Output Device: Transistor
• Number Of Elements: 2
• Reverse Breakdown Voltage: 5V
• Forward Voltage: 1.3V
• Forward Current: 50mA
• Collector-emitter Voltage: 55V
• Package Type: PDIP
• Collector Current (dc) (max): 50mA
• Power Dissipation: 150mW
• Collector-emitter Saturation Voltage: 0.4V
• Pin Count: 8
• Mounting: Through Hole
• Operating Temp Range: -25C to 75C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP624-2F

Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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●
●
●
●
●
●
●
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC