PC4SD21YXPCF Sharp Microelectronics, PC4SD21YXPCF Datasheet - Page 11

• Manufacturer Part Number: PC4SD21YXPCF
• Description: PHOTOCOUPLER 800V 5MA GW 6-SMD
• Manufacturer: Sharp Microelectronics

Specifications of PC4SD21YXPCF

• Voltage - Isolation: 5000Vrms
• Number Of Channels: 1
• Voltage - Off State: 800V
• Output Type: AC, Triac, Zero Cross
• Current - Gate Trigger (igt) (max): 5mA
• Current - Hold (ih): 100µA
• Current - Dc Forward (if): 50mA
• Current - Output / Channel: 100mA
• Mounting Type: Surface Mount
• Package / Case: 6-SMD
• No. Of Channels: 1
• Input Current: 20mA
• Output Voltage: 800V
• Opto Case Style: SMD
• No. Of Pins: 6
• Approval Bodies: CSA
• Approval Category: UL Recognised
• External Depth: 7.62mm
• External Length /: RoHS Compliant
• Isolation Voltage: 5kV
• Output Device: Triac
• Peak Output Voltage (vdrm): 800 V
• Maximum Input Voltage: 1.4 V
• Maximum Output Voltage: 560 VAC
• Minimum Trigger Current: 5 mA (Max)
• Configuration: 1
• Maximum Continuous Output Current: 100 mA
• Maximum Input Current: 50 mA
• Maximum Operating Temperature: + 100 C
• Maximum Reverse Diode Voltage: 6 V
• Maximum Turn-on Time: 50 us
• Minimum Operating Temperature: - 30 C
• Mounting Style: SMD/SMT
• Typical Input Voltage: 1.2 V
• Zero-crossing Circuit: Yes
• Zero-crossing Voltage: 20 V
• Optocoupler Output Type: Phototriac
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 425-2537-2

■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
11
3
Reflow
220˚C or more, 60s or less
4
PC4SD21NTZ Series
(min)
Sheet No.: D2-A07901EN