AFCT-5962ATGZ Avago Technologies US Inc., AFCT-5962ATGZ Datasheet - Page 9

• Manufacturer Part Number: AFCT-5962ATGZ
• Description: TXRX OPT SM SONET OC3/SDH 2X10
• Manufacturer: Avago Technologies US Inc.
• Series: METRAKr

Specifications of AFCT-5962ATGZ

• Applications: General Purpose
• Data Rate: 155Mbps
• Wavelength: 1300nm
• Voltage - Supply: 3.1 V ~ 3.5 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Data Rate Max: 0.155Gbps
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package footprint and front panel considerations
Avago Technologies transceivers comply with the
circuit board “Common Transceiver Footprint” hole
pattern defined in the current multisource agreement
which defined the 2 x 10 package style. This
drawing is reproduced in Figure 7 with the addition
of ANSI Y14.5M compliant dimensioning to be used
as a guide in the mechanical layout of your circuit
board. Figure 8 shows the front panel dimensions
associated with such a layout.
Eye Safety Circuit
For an optical transmitter device to be eye-safe in
the event of a single fault failure, the transmitter
must either maintain eye-safe operation or be
disabled.
The AFCT-5962TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ is
intrinsically eye safe and does not require shut
down circuitry.
Signal Detect
The Signal Detect circuit provides a de-asserted
output signal when the optical link is broken (or
when the remote transmitter is OFF). The Signal
Detect threshold is set to transition from a high to
low state between the minimum receiver input
optical power and -45 dBm avg. input optical
power indicating a definite optical fault (e.g. unplugged
connector for the receiver or transmitter, broken
fiber, or failed far-end transmitter or data source).
The Signal Detect does not detect receiver data
error or error-rate. Data errors can be determined
by signal processing offered by upstream PHY ICs.
Figure 7. Recommended Board Layout Hole Pattern
9
(0.299)
(0.525)
13.34
7.59
2 x Ø 2.29 MAX.
(0.118)
3
(0.09)
(0.055 ±0.004)
*4
2 x Ø 1.4 ±0.1
(0.236)
(0.118)
6
3
(0.28)
7.11
(0.35)
8.89
(0.18)
4.57
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
9 x 1.78
(0.07)
(0.63)
16
(0.121)
3.08
(0.079)
(0.14)
3.56
2
10.16
(0.4)
(0.378)
20 x Ø 0.81 ±0.1
9.59
(0.032 ±0.004)
2 x Ø 2.29
(0.09)
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns
is the control of electromagnetic emissions from
electronic equipment. Success in controlling generated
Electromagnetic Interference (EMI) enables the
designer to pass a governmental agency’s EMI
regulatory standard and more importantly, it reduces
the possibility of interference to neighboring
equipment. Avago has designed the AFCT-5962TLZ/
TGZ/ATLZ/ATGZ/NLZ/NGZ to provide excellent EMI
performance. The EMI performance of a chassis is
dependent on physical design and features which
help improve EMI suppression. Avago Technologies
encourages using standard RF suppression practices
and avoiding poorly EMI-sealed enclosures.
Avago Technologies’ OC-3 LC transceivers (AFCT-
5962TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ) have nose
shields which provide a convenient chassis connection
to the nose of the transceiver. This nose shield
improves system EMI performance by effectively
closing off the LC aperture. The recommended
transceiver position, PCB layout and panel opening
for these devices are the same, making them
mechanically drop-in compatible. Figure 8 shows
the recommended positioning of the transceivers
with respect to the PCB and faceplate.
(0.055 ±0.004)
*5
4 x Ø 1.4 ±0.1
(0.079)
2
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS
2. THE HATCHED AREAS ARE KEEP-OUT AREAS
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26
*4. THE MOUNTING STUDS SHOULD BE
*5. HOLES FOR OPTIONAL HOUSING LEADS MUST
RECOMMENDED CIRCUIT BOARD LAYOUT FOR
THE SFF TRANSCEIVER.
RESERVED FOR HOUSING STANDOFFS. NO
METAL TRACES ORGROUND CONNECTION IN
KEEP-OUT AREAS.
PCB HOLES (20 I/O PINS, 2 SOLDER POSTS
AND 4 OPTIONAL PACKAGE GROUNDING
TABS). PACKAGE GROUNDING TABS SHOULD
BE CONNECTED TO SIGNAL GROUND.
SOLDERED TO CHASSIS GROUND FOR
MECHANICAL INTEGRITY AND TO ENSURE
FOOTPRINT COMPATIBILITY WITH OTHER SFF
TRANSCEIVERS.
BE TIED TO SIGNAL GROUND.
FIGURE
DESCRIBES
MSA