JC050B1 Lineage Power, JC050B1 Datasheet - Page 12

• Manufacturer Part Number: JC050B1
• Description: CONVERTER DC/DC 12V 50W OUT
• Manufacturer: Lineage Power
• Series: JC050r
• Type: Isolated with Remote On/Offr

Specifications of JC050B1

• Output: 12V
• Number Of Outputs: 1
• Power (watts): 50W
• Mounting Type: Through Hole
• Voltage - Input: 18 ~ 36V
• Package / Case: 9-DIP Module
• 1st Output: 12 VDC @ 4.2A
• Size / Dimension: 2.40" L x 2.28" W x 0.52" H (61mm x 57.9mm x 13.2mm)
• Power (watts) - Rated: 50W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 85%
• Approvals: CSA, UL, VDE
• Product: Isolated
• Output Power: 60 W
• Input Voltage Range: 18 V to 36 V
• Input Voltage (nominal): 28 V
• Output Voltage (channel 1): 12 V
• Output Current (channel 1): 5 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 12 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: No

18 Vdc to 36 Vdc Input, 12 Vdc Output; 50 W to 100 W
12
12
Thermal considerations
Heat Transfer Without Heat Sinks
Figure 23. JC075B Power Dissipation vs.
Figure 24. JC100B Power Dissipation vs.
20
18
16
14
12
10
25
20
15
10
8
6
4
2
0
5
0
0.0
0
0.5 1
Output Current
1.0
Output Current
1.5
2.0
OUTPUT CURRENT, I
OUTPUT CURRENT, I
2
V
V
V
I
I
I
3.0
= 24 V
= 18 V
= 36 V
2.5 3 3.5
V
V
V
I
I
I
= 18
= 28
= 36
4.0
5.0
(continued)
4
O
O
(A)
4.5 5
(A)
6.0
(continued)
7.0
5.5 6 6.5
8.0
8-1494
8-1250
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N-m (5 in.-lb.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (ΔT
module power dissipation (P
The location to measure case temperature (T
shown in Figure 20. Case-to-ambient thermal resis-
tance vs. airflow is shown, for various heat sink config-
urations and heights, in Figure 25. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
Figure 25. Case-to-Ambient Thermal Resistance
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 25 had a
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 25 is shown in the following example
θ
ca
8
7
6
5
4
3
2
1
0
0
=
Curves; Either Orientation
ΔT
-------------------- -
AIR VELOCITY MEASURED IN m/s (ft./min.)
(100)
0.5
P
C max
,
D
(200)
1.0
=
(
----------------------- -
T
D
C
(300)
):
P
1.5
–
D
Lineage Power
March 2008
C, max
T
1 1/2 IN HEAT SINK
1 IN HEAT SINK
1/2 IN HEAT SINK
1/4 IN HEAT SINK
NO HEAT SINK
A
)
(400)
) divided by the
2.0
(500)
2.5
C
) is
(600)
3.0
8-1153