NH020Y2 Lineage Power, NH020Y2 Datasheet - Page 14

• Manufacturer Part Number: NH020Y2
• Description: CONVERTER DC/DC 1.8V 10.8W OUT
• Manufacturer: Lineage Power
• Series: NH020r
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of NH020Y2

• Output: 1.8V
• Number Of Outputs: 1
• Power (watts): 20W
• Mounting Type: Through Hole
• Voltage - Input: 4.5 ~ 5.5V
• Package / Case: 9-SIP Module
• 1st Output: 1.8 VDC @ 6A
• Size / Dimension: 2.50" L x 0.24" W x 0.55" H (63.5mm x 6.1mm x 14mm)
• Power (watts) - Rated: 10.8W
• Operating Temperature: 0°C ~ 115°C
• Efficiency: 75%
• Approvals: CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -

Lineage Power
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant compo-
nents. They are designed to be processed through single or
dual wave soldering machines. The pins have an RoHS-
compliant finish that is compatible with both Pb and Pb-free
wave soldering processes. A maximum preheat rate of 3°C/s
is suggested. The wave preheat process should be such
that the temperature of the power module board is kept
below 210°C. For Pb solder, the recommended pot temper-
ature is 260°C, while the Pb-free solder pot is 270°C max.
Not all RoHS-compliant through-hole products can be pro-
cessed with paste-through-hole Pb or Pb-free reflow pro-
cess. If additional information is needed, please consult with
your Tyco Electronics Power System representative for more
details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Tyco
Electronics Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These
requirements state that solder balls must neither be loose
nor violate the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
Data Sheet
March 28, 2008
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 20 W
NH020-Series Power SIPs:
14