PMF30XA1 Microchip Technology, PMF30XA1 Datasheet - Page 5

PROCESSOR MODULE FOR ICE4000

PMF30XA1

Manufacturer Part Number
PMF30XA1
Description
PROCESSOR MODULE FOR ICE4000
Manufacturer
Microchip Technology
Datasheet

Specifications of PMF30XA1

Accessory Type
Processor Module
Product
Microcontroller Modules
Core Processor
dsPIC30F
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
ICE4000
For Use With
ICE4000 - EMULATOR MPLAB-ICE 4000 POD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
PMF30XA1R
PMF30XA1R
6.0
To connect an emulator device adapter directly to a
target board (without the use of transition sockets) the
following information will be helpful.
6.1
DIP device adapter footprints shown will accept
adapter plugs like Samtec series APA plugs. These
plugs can be soldered in place during development/
emulation and eliminate the need for any other sockets.
FIGURE 6-1:
TABLE 6-1:
© 2005 Microchip Technology Inc.
18/28/40P DIP
18/28/40P DIP
18/28/40P DIP
* See the MPLAB ICE 4000 Readme file for informa-
tion on devices supported by each DAF.
Package
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing of DIP is 40 pin.
Processor Module and Device Adapter Specification
DEVICE ADAPTER TARGET
FOOTPRINTS
DIP Device Footprints
A
See Table 6-1 for A & B dimensions.
0.100
x
x = Pin 1 location
18 Pin
28 Pin
40 Pin
DAF DRAWING – DIP
DAF DIMENSIONS – DIP
x
28
40
DAF18-2
DAF18-4
DAF30-4
0.028 DIA
PLATED-THRU
HOLES
DAF Number*
DIP
x
18
0.300
0.300
0.600
B
C
2.600
2.600
2.600
A
C
2.950
3.100
3.300
B
Preliminary
6.2
TQFP/PLCC device adapter footprints shown will
accept board stackers like Samtec series DWM 0.050
Pitch Stackers. These stackers can be soldered in
place during development/emulation and eliminate the
need for any other sockets.
FIGURE 6-2:
TABLE 6-2:
44P TQFP/PLCC
44P TQFP/PLCC
44P TQFP/PLCC
* See the MPLAB ICE 4000 Readme file for informa-
tion on devices supported by each DAF.
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing of device is 44-pin TQFP/PLCC.
Package
0.028 DIA
PLATED-THRU
HOLES
See Table 6-2 for A & B dimensions.
A
TQFP/PLCC Device Footprints
0.050
x = TQFP Pin 1 location
y = PLCC Pin 1 location
x
DAF DRAWING – SINGLE-
ROW TQFP/PLCC
DAF DIMENSIONS – TQFP/
PLCC
DAF Number*
DAF18-3
DAF18-5
DAF30-3
y
0.800
B
2.600
2.600
2.600
DS51298E-page 5
A
0.800
2.950
3.100
2.950
B

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